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A kind of flexible circuit board and preparation method thereof

A flexible circuit board, modified technology, applied in the direction of printed circuit components, non-polymer adhesive additives, adhesive types, etc., can solve the problems of expensive raw materials, easy foaming, and deformation of the cover film, and achieve extension Good resistance, enhanced tensile properties, and improved ductility

Active Publication Date: 2021-09-28
SHENZHEN KNQ SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a flexible circuit board, which aims to solve the problems that the raw material of the cover film of the existing flexible circuit board is expensive, and the preparation process is easy to foam, wrinkle, and deform.

Method used

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  • A kind of flexible circuit board and preparation method thereof
  • A kind of flexible circuit board and preparation method thereof
  • A kind of flexible circuit board and preparation method thereof

Examples

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preparation example Construction

[0031] Correspondingly, specific embodiments of the present invention also provide a method for preparing the above-mentioned black glue layer. The method comprises the steps of:

[0032] S01: Weigh each component according to the above-mentioned vinyl layer;

[0033] S02: Mixing the weighed modified epoxy resin, accelerator, dye, and matte powder to obtain a first mixed material;

[0034] S03: placing the first mixed material in a high-speed disperser for dispersion treatment to obtain a second mixed material;

[0035] S04: Filter the second mixed material to obtain a black glue layer.

[0036] Specifically, the preferred contents and types of the components of the black glue layer in the above step S01 are as described above, and will not be repeated here to save space.

[0037] In the above step S02, the mixing process can be carried out in a conventional mixing manner, such as stirring, as long as each component is mixed evenly.

[0038] In the above step S03, the firs...

Embodiment 1

[0071] Content and preparation method of filling glue used for diaphragm of wireless charging coil. Wherein, the weight ratio components contained in the filler component used for the diaphragm of the wireless charging coil are as described in Table 1 below. Among them, the modified epoxy resin used contains components: 30% resin AS-60, 30% toluene, 30% methanol, 10% aluminum hydroxide; the used accelerator contains components: 90% modified epoxy resin, 10% 2-Methylimidazole. The dye used contained the composition: 40% carbon black, 60% methanol. The matte powder used contains components: 90% modified epoxy resin, 10% matte powder.

[0072] The preparation method of the filling glue for the diaphragm of the wireless charging coil: under normal temperature and pressure, weigh the required substances according to the composition ratio of the above components, and mix 55% modified epoxy resin, 15% accelerator, 20% The dye and 10% matte powder are stirred and mixed to obtain th...

Embodiment 2

[0077]Content and preparation method of filling glue used for diaphragm of wireless charging coil. Wherein, the weight ratio components contained in the filler component used for the diaphragm of the wireless charging coil are as described in Table 1 below. Among them, the modified epoxy resin used contains components: 30% resin AS-60, 30% toluene, 30% methanol, 10% aluminum hydroxide; the used accelerator contains components: 90% modified epoxy resin, 10% 2-Methylimidazole. The dye used contained the composition: 40% carbon black, 60% methanol. The matte powder used contains components: 90% modified epoxy resin, 10% matte powder.

[0078] The preparation method of the filling glue used for the diaphragm of the wireless charging coil: under normal temperature and pressure, the required substances were weighed according to the composition ratio of the above components, and 66% modified epoxy resin, 20% accelerator, 10% The dye and 10% matte powder are stirred and mixed to ob...

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Abstract

The invention provides a flexible circuit board, the flexible circuit board is sequentially laminated and combined with a first cover film, a shielding film, a base material and a second cover film; the first cover film, the second cover film The films all include a carrier layer and a protective layer arranged oppositely, and a black glue layer arranged between the carrier layer and the protective layer, wherein, based on the total weight of the black glue layer as 100%, the black The adhesive layer includes the following raw material components by weight: 55%-70% modified epoxy resin, 5%-25% accelerator, 5%-20% dye, 5%-10% matte powder. The thickness of the prepared flexible circuit board is controllable, the product has high stability, good ductility, enhanced tensile performance, and is not easy to be damaged, and effectively solves the problem that the polyimide film needs to be imported.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a flexible circuit board used for a wireless charger and a preparation method thereof. Background technique [0002] With the development of electronic technology, electronic devices such as mobile phones, tablet computers, and cameras have become an indispensable part of people's daily life, and people's requirements for electronic devices are also getting higher and higher. In order to meet people's requirements, wireless charging technology is gradually applied to electronic devices. Wireless charging technology can transmit energy through electromagnetic waves, realize wireless charging of electronic devices by wireless chargers, and improve the convenience of charging electronic devices. [0003] A wireless charger refers to a charger that is connected to a terminal device that needs to be charged without a traditional charging power cord. It adopts ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02C09J163/00C09J11/04C09J11/08
CPCC08K2003/2227C08K2201/003C08L2201/02C08L2201/08C08L2205/025C09J11/04C09J11/08C09J163/00H05K1/02C08L63/00C08K3/04C08K3/22
Inventor 由龙赵伟业林翠盈顾婧文
Owner SHENZHEN KNQ SCI & TECH CO LTD
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