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Method for improved semiconductor processing equipment tool pedestal/pad vibration isolation and reduction

A semiconductor and pad technology, applied in the field of improved semiconductor processing equipment tool base/pad vibration isolation and vibration reduction, can solve the problems of reducing production yield, vibration deviation, etc., to achieve increased output and processing efficiency, and good production income efficiency, increase productivity

Inactive Publication Date: 2019-03-19
에스케이커머셜컨스트럭션인크
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0022] Vibration causes deflection, which can have a damaging effect on expensive high-precision machine tools, which in turn reduces production yields

Method used

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  • Method for improved semiconductor processing equipment tool pedestal/pad vibration isolation and reduction
  • Method for improved semiconductor processing equipment tool pedestal/pad vibration isolation and reduction
  • Method for improved semiconductor processing equipment tool pedestal/pad vibration isolation and reduction

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Embodiment Construction

[0064] The detailed description set forth below in connection with the accompanying drawings is intended as a description of exemplary embodiments in which the disclosed processes may be practiced. The term "exemplary" is used throughout this specification to mean "serving as an example, instance, or illustration" and should not be construed as preferred or advantageous over other embodiments. This detailed description includes specific details to provide a thorough understanding of the disclosed methods and systems. It will be apparent, however, to one skilled in the art that the presently disclosed methods may be practiced without these specific details. In some instances, well-known structures and devices are shown in block diagram form in order to avoid obscuring the concepts of the disclosed methods and systems.

[0065] In this specification, an embodiment showing a single component should not be considered limiting. Conversely, the subject matter preferably encompasse...

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PUM

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Abstract

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation / reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.

Description

[0001] Cross References to Related Applications [0002] This application also claims the benefit of the following non-provisional applications, all of which are expressly incorporated herein by reference in their entirety: [0003] 15 / 640,558, filed July 2, 2017, entitled "Methods for Improved Semiconductor Processing Equipment Tool Mount / Pad Vibration Isolation and Damping," Attorney Docket No. SKCC005US2; [0004] 15 / 495,887, filed April 24, 2017, entitled "Methods for Improved Semiconductor Processing Equipment Tool Mount / Pad Vibration Isolation and Damping," Attorney Docket No. SKCC005US1; and [0005] 15 / 472,154, filed March 28, 2017, entitled "Methods and Systems for Improved Vibration Isolation and Damping of Semiconductor Processing Equipment," Attorney Docket No. SKCC005US0TR. technical field [0006] The present disclosure relates to semiconductor and similar high precision processing facilities, and more particularly to an improved semiconductor processing equipme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16M7/00F16F15/04H01L21/67H01L21/687
CPCE04C3/36F16F15/005F16F15/04F16F2224/0225F16F2226/04F16M7/00G03F7/70808G03F7/709H01L21/67017H01L21/68792H02K5/24
Inventor 淑·K·金-维堤
Owner 에스케이커머셜컨스트럭션인크
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