LED COB packaging method and LED packaging module
A packaging method and module technology, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of difficult yield, cumbersome process, breakdown of pixel units, etc., to improve production efficiency and yield, and improve production efficiency. , The effect of preventing electrostatic breakdown
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[0063] Example 1
[0064] image 3 The flow chart of the COB packaging method of LED provided by this embodiment, Figure 4 The state diagram of the glue spraying process of the COB packaging method of the LED provided in this embodiment is combined below image 3 with Figure 4 This embodiment will be described in detail.
[0065] Such as image 3 As shown, the COB packaging method of LED provided in this embodiment at least includes the steps:
[0066] S100: Fix each LED light-emitting chip to the front of the PCB board;
[0067] S200: Use wires to connect each LED light-emitting chip to the PCB board through welding;
[0068] S300: Sprinkle glue on the front side of the PCB board according to the preset spraying method, so that the entire surface of each LED light-emitting chip and the front side of the PCB board are continuously covered by the glue;
[0069] S400: The PCB board after the glue is poured and sealed, is allowed to stand, and after the glue is solidified, bake and solidi...
Example Embodiment
[0096] Example 2
[0097] The red LED chip, the green LED chip and the blue LED chip in the LED light emitting chip are respectively fixed on the PCB board through silver paste or insulating glue.
[0098] Connect the positive electrode of the red LED chip to the positive electrode pad on the PCB through a wire, and the negative electrode of the red LED chip is directly connected to the negative electrode pad on the PCB; connect the positive and negative of the green LED chip and the blue LED chip The poles are respectively connected to the positive and negative pads on the PCB board through wires.
[0099] A plurality of glue guns 600 are arranged at equal intervals at the first end 101 of the PCB board, and the plurality of glue guns 600 are placed above the PCB board. The glue guns can be set to 2 to 5, for example, 3. Control the glue outlet of each glue gun to continuously and evenly discharge glue, and 3 glue guns simultaneously spray glue on the PCB board, and spray the glue...
Example Embodiment
[0102] Example 3
[0103] Figure 5 It is a schematic diagram of a longitudinal cross-sectional structure of the LED package module provided by this embodiment, Image 6 It is a top view of the LED package module provided by this embodiment, Figure 7 The partial schematic diagram of the LED package module provided in this embodiment is combined below Figure 5-7 This embodiment will be specifically described.
[0104] Such as Figure 5 As shown, the LED packaging module prepared according to the COB packaging method of the LED described in the above embodiment includes: a PCB board 100, a plurality of LED light-emitting chips 200, and a colloid layer 300;
[0105] A plurality of LED light-emitting chips 200 are fixed on the front surface of the PCB board 100, and each LED light-emitting chip 200 is electrically connected to the PCB board 100 through a wire 400;
[0106] The colloid layer 300 is covered on the front surface of the PCB board 100 by glue encapsulation so that each LED l...
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