An electric field-driven device and method for transferring a small amount of high-viscosity glue solution

Abstract

The invention provides an electric field driven micro high viscosity glue solution transferring device and method and belongs to the field of fine parts and microelectronic apparatus assembly. The device comprises an electric field control part and a mechanical part. The electric field control part comprises a high voltage power supply, a power supply switch, a dispensing needle, a glue storage pond and an ampere meter. The mechanical part comprises a dispensing needle, a glue storage pond, a first temperature control objective table, a second temperature control objective table, a Y-directionautomatic slide table, a needle clamp, a Z-direction automatic slide table, an X-direction automatic slide table, a first column, a second column, a substrate and a to-be-glued workpiece. The singleflue fetching amount is nL-pL order without processing a very fine needle head. The micro high viscosity glue solution can be transferred by means of a needle head with millimeter diameter. The consumption of the glue solution is very small and the production cost is saved. The control parts and pipelines are not driven by using a dispensing valve, a pressure pump, a plunger pump and the like, sothat the equipment cost is saved. The system is simple to operate, few in auxiliary treatment links and easy for industrial on-site use.

Description

technical field [0001] The invention belongs to the field of assembly and assembly of tiny parts and microelectronic devices, and relates to a device and method for transferring a small amount of high-viscosity glue liquid driven by an electric field. Background technique [0002] Using liquid glue to glue together multiple tiny mechanical parts or microelectronic devices is the main way to assemble and connect at the millimeter-micron scale. The key is to transfer nanoliter to picoliter glue to the parts to be bonded . At present, jet dispensing technology is the most widely used, but it is only suitable for glue with low viscosity. For high-viscosity glue (>1Pa·s), due to the restriction of viscous resistance, very high pressure is required to spray to form nanoliter to picoliter-level glue droplets, and air bubbles and residual deterioration glue are prone to appear in the syringe Liquid, need glue filling and cleaning treatment, the operation is more cumbersome. ...

AI Technical Summary

Problems solved by technology

At present, jet dispensing technology is the most widely used, but it is only suitable for glue with low viscosity

For high-viscosity glue (>1Pa·s), due to the restriction of viscous resistance, very high pressure is required to spray to form nanoliter to picoliter-level glue droplets, and air bubbles and residual deterioration glue are prone to appear in the syringe Liquid, need glue filling and cleaning treatment, the operation is more cumbersome

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