Lamb wave resonator and preparation method thereof
A Lamb wave resonator and resonator technology, applied in impedance networks, electrical components, microstructure technology, etc., can solve the problems of poor crystal quality and the performance of Lamb wave resonators are smaller than expected, and achieve the effect of improving device performance.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0033]In addition, the present invention proposes a method for preparing a Lamb wave resonator, which includes the following steps: Step 1, growing a single crystal nitride thin film layer on a base material at high temperature, and successively growing a single crystal nitride thin film layer on the upper surface of the single crystal nitride thin film layer. Form a bottom electrode layer, a dielectric sacrificial layer and a base support layer; step 2, remove the base material, and prepare interdigitated electrodes in the central area of the lower surface of the single crystal nitride film layer; step 3, solder the devices in step 2 by solder On the substrate layer, and form a gap between the interdigital electrodes and the substrate layer; step 4, corrode the dielectric sacrificial layer to remove the dielectric sacrificial layer and the base support layer, and complete the preparation of the Lamb wave resonator.
[0034] Due to the combination of welding and corrosion pro...
Embodiment
[0044] Such as Figure 4 As shown, the present embodiment proposes a Lamb wave resonator 200, including a substrate layer 210 and a resonator structure 220. The resonator structure includes a bottom electrode layer 221, a single crystal nitride thin film layer 222 and interdigitated fingers from bottom to top. An electrode 223, wherein: the interdigitated electrode 223 is located in the central region of the single crystal nitride thin film layer 222; the resonator structure 220 is placed upside down on the upper surface of the substrate layer 210, and a metal layer 230 is arranged between the resonator structure 220 and the substrate layer 210, There is a gap between the interdigital electrodes 223 and the substrate layer 210 .
[0045] This embodiment also proposes a Figure 4 The preparation method of the shown Lamb wave resonator 200 is as follows in conjunction with the attached Figure 5(a) ~ Figure 5(g) , the preparation method is described in detail, specifically com...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com