Modified resin material for heat conduction and heat dissipation, preparation method and application of material

A modified resin and thermally conductive filler technology, which is applied in the field of modified resin materials and their preparation, can solve problems such as insufficient toughness of heat dissipation materials, and achieve good toughness, good technical effects, and excellent comprehensive performance

Active Publication Date: 2019-04-05
CHINA PETROLEUM & CHEM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] One of the technical problems to be solved by the present invention is the problem of insufficient toughness of the heat dissipation material whe

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Surface treatment of thermally conductive filler: weigh flake graphene YH5 (particle size D 50 : 150μm, thickness 80nm) 1 part, carbon fiber powder CF-100 (particle size D 50 : 100 μm) 4.5 parts and 2 parts of silane modifier KH-550 concentration of 2.75% ethanol solution in a stainless steel vessel were fully stirred and mixed, dried naturally and then dried at 100 ° C for 4 hours to obtain thermally conductive filler TC1.

[0036] Preparation of modified resin material for heat conduction and heat dissipation: polycarbonate pellets (melt index 11.7g·10min -1 ) 66.5 parts, poly(styrene-butadiene) / polymethyl methacrylate core-shell copolymer MBS 1.5 parts, poly(butadiene-styrene) SBR 2 parts, respectively at 105 ° C, 60 ° C and 50 After drying under vacuum for 6 hours at ℃, mix well with 27.5 parts of TC1, 1 part of tributyl phosphate, 0.8 parts of 1010, and 1.6 parts of white oil in a high-speed mixer for 2 minutes. The mixed material was introduced into a twin-screw...

Embodiment 2

[0040] The surface treatment method of the thermally conductive filler is the same as in Example 1.

[0041] Preparation of modified resin material for heat conduction and heat dissipation: polycarbonate pellets (melt index 11.7g·10min -1) 63 parts, poly(styrene-butadiene) / polymethyl methacrylate core-shell copolymer MBS 5 parts, poly(butadiene-styrene) SBR 2 parts, respectively at 105 ℃, 60 ℃ and 50 After drying under vacuum for 6 hours at ℃, mix well with 27.5 parts of TC1, 1 part of tributyl phosphate, 0.8 parts of 1010, and 1.6 parts of white oil in a high-speed mixer for 2 minutes. The mixed material was introduced into a twin-screw extruder, and 2.5 parts of carbon fiber H2550 (diameter 10 μm) was introduced from the middle section of the extruder, and the modified resin material A2 for heat conduction and heat dissipation was obtained through melt extrusion and granulation. The temperature of the 1st to 9th section of the twin-screw extruder and the die mouth are 220°C...

Embodiment 3

[0045] The surface treatment method of the thermally conductive filler is the same as in Example 1.

[0046] Preparation of modified resin material for heat conduction and heat dissipation: polycarbonate pellets (melt index 11.7g·10min -1 ) 59.5 parts, poly(styrene-butadiene) / polymethyl methacrylate core-shell copolymer MBS 8.5 parts, poly(butadiene-styrene) SBR 2 parts, respectively at 105 ° C, 60 ° C and 50 After drying under vacuum for 6 hours at ℃, mix well with 27.5 parts of TC1, 1 part of tributyl phosphate, 0.8 parts of 1010, and 1.6 parts of white oil in a high-speed mixer for 2 minutes. The mixed material was introduced into a twin-screw extruder, and 2.5 parts of carbon fiber H2550 (diameter 10 μm) was introduced from the middle section of the extruder, and the modified resin material A3 for heat conduction and heat dissipation was obtained through melt extrusion and granulation. The temperature of the 1st to 9th section of the twin-screw extruder and the die mouth ...

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Abstract

The invention relates to a modified resin material for heat conduction and heat dissipation, a preparation method and an application of the material, and mainly solves the problem of insufficient toughness of a heat dissipation material when the amount of a heat conduction filler is high in the prior art. The modified resin material used for heat conduction and heat dissipation comprises the following components in parts by weight: (A) 30-70 parts of matrix resins; (B) 20-60 parts of heat conduction fillers; (C) 0.1-20 parts of toughening agents; (D) 0-10 parts of other auxiliary agents. The modified resin material can better solve the problem, and can be used in industrial production of heat dissipation components such as electronics, household appliances, automobiles, lighting and the like.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, and relates to a modified resin material for heat conduction and heat dissipation, a preparation method and application thereof. The modified resin material for heat conduction and heat dissipation is suitable for heat dissipation components such as electronics, home appliances, automobiles, and lighting. Background technique [0002] Thermally conductive materials are often used in heat exchange, heat dissipation, electronics and electrical industries. In recent years, the trend of light weight, miniaturization and high performance of electronic and electrical equipment is obvious, and the heat generation of its heating components is also increasing. To improve the heat dissipation performance of heat-generating devices, it is particularly urgent to develop thermally conductive materials with high thermal conductivity and cost advantages. Compared with traditional metals, ceramics an...

Claims

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Application Information

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IPC IPC(8): C08L69/00C08L51/04C08L51/00C08L9/06C08L91/06C08K13/06C08K9/06C08K5/521C08K3/04C08K7/06
CPCC08L69/00C08K2201/003C08L2205/06C08L2205/035C08L2205/03C08L2207/53C08L51/04C08L9/06C08L91/06C08K13/06C08K9/06C08K5/521C08K3/04C08K7/06C08L51/003
Inventor 于志省白瑜
Owner CHINA PETROLEUM & CHEM CORP
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