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Metallographic corrosive and metallographic structure display method of copper and copper alloy

A metallographic structure display and copper alloy technology, applied in the field of metallographic structure display of copper and copper alloys, and metallographic etchant, can solve the problems of cumbersome display methods and steps, poor effect, and difficult to control the degree of corrosion, etc., to achieve improved Corrosion efficiency and the effect of surface metallographic microstructure display effect

Pending Publication Date: 2019-04-05
FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO LTD +1
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  • Abstract
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Problems solved by technology

[0003] However, in the prior art, the effect of layered metallographic microstructure display on copper and copper alloys is relatively poor, and the methods and steps for performing metallographic microstructure display on copper and copper alloy layers are cumbersome
For example, electrolytic corrosion of copper and copper alloys will be affected by factors such as voltage, current, temperature and time, and the degree of corrosion is difficult to control

Method used

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  • Metallographic corrosive and metallographic structure display method of copper and copper alloy
  • Metallographic corrosive and metallographic structure display method of copper and copper alloy

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Embodiment Construction

[0019] In order to enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be described in detail below in conjunction with specific examples. The display method includes the following steps:

[0020] The first step is to provide copper and copper alloy metallographic samples, such as figure 1 As shown, the metallographic sample includes a copper layer 11 and a copper alloy layer 12 plated on the copper layer 11, and the dotted line M is the dividing line between the two layers, and the dividing line is not obvious in the real object;

[0021] In the second step, a container (not shown) is provided, the metallographic sample is fixed into the container with a fixture, and liquid polyflor resin is injected, and the metallographic sample is put into the polyflor resin for 4h to 6h cold embedding, the effect after cold embedding is as follows figure 1 As shown, the Polyflor resin layer 13 is surrounded on...

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Abstract

The invention provides a metallographic structure display method of copper and a copper alloy. The metallographic structure display method of the copper and the copper alloy comprises the steps of: (1), providing a metallographic sample of the copper and the copper alloy, wherein the metallographic sample comprises a copper layer and a copper alloy layer plated on the copper layer; (2), providinga container, fixing the metallographic sample into the container, and adding polyflor resin; (3), taking out the metallographic sample encircled by the polyflor resin, mechanically grinding the metallographic sample, and then, mechanically polishing the grinded metallographic sample; (4), providing a metallographic corrosive, wherein the metallographic corrosive is mixed solution of ferric trichloride and hydrochloric acid, and performing metallographic micro-corrosion by dip dyeing of the polished metallographic sample through the metallographic corrosive; and (5), washing and drying the corroded metallographic sample, observing the copper layer and the copper alloy layer of the dried metallographic sample by using a microscope, so that the boundary of the copper and the copper alloy canbe displayed clearly, and measurement of the thickness of the copper layer can be easily carried out.

Description

【Technical field】 [0001] The invention relates to a metallographic structure observation test technology, in particular to a metallographic corrosion agent, copper and copper alloy metallographic structure display method applied to the observation of the metallographic microstructure of the surface coating. 【Background technique】 [0002] The internal structure of metal materials is directly and closely related to material properties such as hardness, strength, and ductility. Metallographic observation is the most direct and effective method for studying the internal structure of metal materials. Metallographic refers to the chemical composition of metal or alloy and the physical state and chemical state of various components inside the metal or alloy. The metallographic microstructure observation method can be used to observe the boundaries and thicknesses of different metal or alloy layers. Among them, the observation of the metallographic microstructure of the surface co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/32C23F1/18
CPCG01N1/32C23F1/18
Inventor 陈祖鹏高丽珠单迎春戴新国梁超
Owner FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO LTD
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