Gold bonding wire drawing device

Abstract

The invention discloses a gold bonding wire drawing device. The gold bonding wire drawing device comprises a machine body, a wire outlet table, a guide wire roller, a supporting rod and a processing device. According to the gold bonding wire drawing device, impurities generally exist on a wire after a wire drawing process, so that the impurities on the surface of the wire needs to be scraped, andthe influence on the quality is prevented; the processing device is arranged in the middle of the top end of the wire outlet table, a scraping device is arranged in the processing device, the middle part of the right side of a main body and a mounting plate are welded, an adjusting groove is formed in the mounting plate, firstly, a user can enable a fixing knob to rotate in the adjusting groove byrotating the fixing knob, finally the proceeding angle of a first inclined plate of the scraping device is determined, and finally, the fixing knob is fixed well so that the angle between an adjusting plate and a scraping plate at the bottom can be adjusted; and when the bottom wire passes, the impurities on the bonding wire can be quickly removed on the premise that the wire is not damaged by the scraping plate, the scraping plate can be replaced, and can be replaced by unscrewing a fixing screw to be separated from the adjusting plate, and the problem that impurities on a wire after wire drawing cannot be quickly removed in the prior art is solved.

Description

technical field [0001] The invention relates to the related field of bonded gold wire processing, in particular to a bonded gold wire drawing device. Background technique [0002] Bonding gold wire is a gold alloy wire used as a connecting wire in integrated circuits, also known as ball bonding gold wire or lead gold wire. The gold content is ≥99.99%, and the sum of trace elements is <0.01%. There are γ-type, C-type and FA type and other three types, the latter two are used for high-speed bonding, and the trace elements are beryllium, copper, silver, etc., which have the functions of refining grains, increasing recrystallization temperature and strengthening gold. Melting and directional crystallization, the ingot is cold-worked into a material after homogenization, or it is manufactured by a liquid extrusion process. Bonding gold wire is an important material in the microelectronics industry. It is used as a connecting wire between the chip and the lead frame. During th...

AI Technical Summary

Problems solved by technology

[0004] 1. The existing bonded gold wire drawing device cannot quickly remove impurities on the wire after drawing

[0005] 2. In the existing bonded gold wire drawing device, after the bonding wire is annealed, there is a water film on the surface, and the removal efficiency is low

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