A local adaptive controllable wettability coupling microstructure enhanced boiling heat transfer method
A locally adaptive and enhanced boiling technology, applied in the field of enhanced heat transfer, which can solve problems such as the increase of vaporization cores and the growth of bubbles
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0035] Single crystal silicon is selected as the heat exchange substrate material, flat, with a size of 30mm×10mm×2mm; the surface is designed with a microcolumn array, the size of the microcolumns is 150μm×150μm×150μm, and the spacing is 200μm; the surface of the heat exchange substrate is metal oxide with excellent thermal conductivity Physical insulating layer with a thickness of 100nm.
[0036] A conductive gold film with a thickness of 100nm is provided as an electrode film on the top of the microcolumn, and the conductive gold film with a thickness of 100nm is used as an electrode lead to connect and lead out the electrode films distributed on the top of the microcolumn. Both have a metal oxide insulating layer with a thickness of 100nm and excellent thermal conductivity.
[0037] Metal copper nanoparticles with a particle size of 30nm are selected, charged with anion and cation surfactants and hydrophobic treatment, and configured into a nanofluid as a heat-exchange worki...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com