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Decapsulation of electronic devices

An electronic device, decapsulation technology, applied in the cleaning/polishing of conductive patterns, circuits, printed circuits, etc.

Active Publication Date: 2019-04-16
JIACO INSTR HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods face the same challenges of decapsulation as described above

Method used

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  • Decapsulation of electronic devices
  • Decapsulation of electronic devices
  • Decapsulation of electronic devices

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0047] In a MIP etching apparatus marketed by Jiaco Instruments B.V. (Delft, The Netherlands) and described in WO2013 / 184000, from argon-containing gas with a flow rate of 400 seem using an argon flow of 1400 seem A gas flow induction plasma of gas and hydrogen (95:5). The plasma was combined with ultrasonic cleaning for depackaging semiconductor devices including silver bonding wires and plastic packaging comprising 10% epoxy resin and 90% silicon filler. An unpackaged semiconductor device was obtained which, on visual inspection, showed a clean wire surface ( figure 1 ).

example 2

[0049] Gas flows comprising argon, nitrogen, and hydrogen (i.e., a first flow of argon (100% by volume) at 1400 seem and a second flow of nitrogen and hydrogen (95% by volume and 5% by volume, respectively) at 25 seem were used. Mixture) The experiment described in Example 1 was repeated. An unpackaged semiconductor device was obtained which, upon visual inspection, showed an acceptably clean and slightly damaged silver line surface.

[0050] example comparison

[0051] Use including Ar / N 2 , Ar / O 2 ( figure 2 ), O 2 / CF 4 Repeat the test described in Example 1 (without ultrasonic cleaning), or use the conventional acid decapsulation method to complete the decapsulation. The results are summarized in Table 1.

[0052] Table 1 Example Comparison

[0053]

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PUM

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Abstract

The invention is directed to a method for treating an electronic device that is encapsulated in a plastic package, said method comprising the steps of providing a gas stream comprising a hydrogen source; inducing a hydrogen-containing plasma stream from said gas; and directing the hydrogen-containing plasma stream to the plastic package to etch the plastic package.

Description

technical field [0001] The invention relates to the field of electronic equipment. More particularly, the present invention relates to the processing of electronic devices, in particular, to the depackaging of semiconductor devices using microwaves induced by plasma, and to apparatus suitable for processing and obtainable processed semiconductor devices. Background technique [0002] Electronic devices are often depackaged for failure analysis and quality control. Depackaging is the process in which an electronic device (eg, an integrated circuit or printed circuit board) packaged in a package is processed to expose the electronic bond wires and die for inspection. It is important that the metal bond wires, metal bond pads, semiconductor die, and other components of the electronic device remain as intact as possible during this process, so that performance such as optical microscopy, scanning electron microscopy (SEM) can be performed. , photoelectric emission microscopy, ...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L21/67H05K3/28H01L21/311
CPCH01L21/31138H01L21/56H05K3/288H01L2224/32225H01L2224/32245H01L2224/45139H01L2224/48227H01L2224/48247H01L2224/73265H01L2224/85439H01L2924/14H01L2924/19041H01L2924/19042H01L2924/19043H01L2924/19105H01L24/45H01L24/98H01L2224/45147H05K3/26H05K2203/0285H05K2203/092H05K2203/095H01L2924/00014H01L2924/00011H01L2924/00012H01L2224/43848H01L2924/01049H01L21/67126H01L24/73
Inventor 唐佳其科内利斯·伊格纳修斯·玛丽亚·贝纳克威利布罗德·杰拉德斯·玛丽亚·范登霍克
Owner JIACO INSTR HLDG BV
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