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Epoxy resin containing naphthalene ring structure and preparation method thereof

A technology of epoxy resin and naphthalene ring, which is applied in the field of epoxy resin containing naphthalene ring structure and its preparation, can solve the problems of many by-products, complicated steps, influence on product performance, etc., so as to reduce water absorption and improve heat resistance. Effect

Active Publication Date: 2019-04-19
SHANGHAI HUAYI RESINS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the synthesis method of epoxy resin containing naphthalene ring structure is complicated, and there are many by-products, and its product performance is affected to a certain extent. However, the preparation method of epoxy resin containing only naphthalene ring structure has not yet been patented.

Method used

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  • Epoxy resin containing naphthalene ring structure and preparation method thereof
  • Epoxy resin containing naphthalene ring structure and preparation method thereof
  • Epoxy resin containing naphthalene ring structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Put 231g of epichlorohydrin and 100g of 1,7-dihydroxynaphthalene into a 2000ml four-necked round bottom flask equipped with a stirrer, thermometer, nitrogen introduction tube, dropping funnel, and condenser (P1, P7 in the general reaction formula) Respectively substituted by hydroxyl, the same below) and 6g benzyl diethyl ammonium bromide, start to heat up under stirring, and react at 60°C for 3 hours. Then the temperature was lowered to 30°C, 200g of sodium hydroxide was added dropwise, the ring-closure reaction was maintained for 2 hours, then the epichlorohydrin was evaporated, toluene was added to the reaction solution to extract the epoxy resin, the oil phase was taken, washed with water and then evaporated to remove the toluene to obtain 1,7 -Dihydroxy naphthalene epoxy resin 150g (R1, R7 are respectively Replaced).

[0030]

Embodiment 2

[0032] Put 677g of epichlorohydrin and 78g of 2,7-dihydroxynaphthalene into a 2000ml four-necked round-bottomed flask equipped with a stirrer, thermometer, nitrogen introduction tube, dropping funnel and condenser. Substituted) and 7.8 g of tetraethylammonium bromide, start to heat up under stirring, and react at 40°C for 5h. Then the temperature was lowered to 40°C, 59g sodium hydroxide was added dropwise to maintain the ring-closure reaction for 6 hours, then the epichlorohydrin was evaporated, toluene was added to the reaction solution to extract the epoxy resin, the oil phase was taken, washed with water and evaporated to remove the toluene to obtain 2,7 -Dihydroxy naphthalene epoxy resin 140g (R2, R7 are respectively Replaced).

Embodiment 3

[0034] Put 578g of epichlorohydrin and 100g of 1,5-dihydroxynaphthalene into a 2000ml four-necked round-bottomed flask equipped with a stirrer, thermometer, nitrogen introduction tube, dropping funnel, and condenser. Substituted) and 5g of benzyltrimethylammonium bromide, start to heat up under stirring, and react at 50°C for 2h. Then 125g of sodium hydroxide was added dropwise, the temperature was raised to 60°C to maintain the ring-closure reaction for 1 hour, then the epichlorohydrin was evaporated, ethylbenzene was added to the reaction solution to extract the epoxy resin, the oil phase was taken, washed with water, and evaporated to obtain 1, 5-dihydroxynaphthalene epoxy resin 144g (R1, R5 are respectively Replaced).

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Abstract

The invention provides an epoxy resin containing a naphthalene ring structure and a preparation method thereof. The preparation method comprises the following steps: firstly, carrying out an additionreaction between a naphthalenic phenol A and epichlorohydrin under the action of a catalyst at a certain temperature; adding a base C to carry out a ring closure reaction; distilling off the remainingepichlorohydrin after the reaction; extracting a reaction solution with a solvent D after the distillation, washing with water, layering and taking the oil phase, and removing the solvent to obtain the epoxy resin containing the naphthalene ring structure. The process is simple; the product has high purity, excellent heat resistance and low water absorption rate, and can be used for packaging large-scale integrated circuits and electronic components; and the application range of the epoxy resin is broadened.

Description

Technical field [0001] The invention belongs to the field of special epoxy resin preparation, and specifically relates to an epoxy resin containing a naphthalene ring structure and a preparation method thereof. Background technique [0002] Epoxy resin has good physical and mechanical properties, electrical insulation properties, chemical corrosion resistance and good mechanical properties. It is widely used in coatings, adhesives, electronic and electrical packaging materials, composite matrix resins and other fields. The continuous progress of science and technology and the semiconductor industry has put forward higher requirements for the heat resistance and water absorption of packaging materials. The development of heat-resistant and low-hygroscopic epoxy resins has very important significance and application value. [0003] From the perspective of synthesis, the introduction of rigid groups such as naphthalene ring, benzene ring, biphenyl, heterocycle and naphthalene ring str...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/06C08G59/50
CPCC08G59/063C08G59/504
Inventor 张丽徐烨黄慧琳吕蔚
Owner SHANGHAI HUAYI RESINS CO LTD