Moisture-curing-reaction-type polyurethane hot melt adhesive and preparation method thereof

A polyurethane hot-melt adhesive, reactive technology, applied in the chemical field, can solve the problems of poor storage stability, etc., and achieve the effect of good softness and good adhesion

Pending Publication Date: 2019-05-14
康达新材料(集团)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, due to poor storage stability, it will react with moisture in the atmosphere, so it must be stored in an airtight container, and there are also problems in handling when used.

Method used

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  • Moisture-curing-reaction-type polyurethane hot melt adhesive and preparation method thereof
  • Moisture-curing-reaction-type polyurethane hot melt adhesive and preparation method thereof
  • Moisture-curing-reaction-type polyurethane hot melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Make 100 parts by weight ("weight" omitted below) polyester diol with a hydroxyl value of 110 obtained by reacting adipic acid, ethylene glycol and 1,4-butanediol with 45.0 parts of 4,4'-diphenylmethane The diisocyanate was reacted at a temperature of 120°C for 2 hours to obtain a polyurethane prepolymer having an isocyanate group at the end. Add 6 parts of 1,4-butanediol (hydroxyl value 1245), 5 parts of ε-caprolactam as a blocking agent and 3 parts of n-octanol to the prepolymer, and react at 120°C for 0.5 hours to obtain blocker Segmented polyurethane prepolymer.

Embodiment 2

[0060] 100 parts of poly-1,4-butanediol having a hydroxyl value of 110 and 20 parts of 4,4'-diphenylmethane diisocyanate were reacted at a temperature of 120°C for 2 hours to obtain a polyurethane prepolymer having an isocyanate group at the end. Then, 8 parts of 1,4-butanediol, 7 parts of ε-caprolactam as a blocking agent and 3 parts of n-octanol were added thereto, and reacted at 120° C. for 0.5 hour to obtain a blocked polyurethane prepolymer.

Embodiment 3

[0062] 100 parts of polyester diol with a hydroxyl value of 110 obtained by reacting adipic acid, ethylene glycol and 1,4-butanediol and 55.0 parts of 4,4'-diphenylmethane diisocyanate were reacted at a temperature of 120°C After 2 hours, a polyurethane prepolymer having an isocyanate group at the end was obtained. Then, 8 parts of 1,4-butanediol, 5 parts of methyl ethyl ketone oxime and 3 parts of n-octanol were added to it, and reacted at 120°C for 0.5 hours to obtain block polyurethane prepolymer body.

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Abstract

The invention discloses a moisture-curing-reaction-type polyurethane hot melt adhesive. The moisture-curing-reaction-type polyurethane hot melt adhesive comprises the following components in parts byweight: 100 parts of linear polyurethane prepolymer with an isocyanate group, 60-80 parts of aliphatic monohydric alcohol of which a hydroxyl value is 300-800, and 40-20 parts of a block agent. The invention further discloses a preparation method for the moisture-curing-reaction-type polyurethane hot melt adhesive. The moisture-curing-reaction-type polyurethane hot melt adhesive has the very goodeffect while a heat resistance problem and an adhesive force deficiency problem occur in a traditional hot melt adhesive. The moisture-curing-reaction-type polyurethane hot melt adhesive has good flexibility and is capable of expressing a good adhesive force. The moisture-curing-reaction-type polyurethane hot melt adhesive is capable of limiting a release quantity of harmful polyisocyanate to theatmosphere while heated and melted, and more environment-friendly. The moisture-curing-reaction-type polyurethane hot melt adhesive can be stored in a state before a block is disaggregated.

Description

technical field [0001] The invention relates to the field of chemical technology, in particular to a moisture-curing reactive polyurethane hot-melt adhesive and a preparation method thereof. Background technique [0002] Adhesives used in the past include solvent-based, thermoplastic hot-melt, and moisture-curing reactive types. [0003] The existing thermoplastic hot-melt adhesives do not use solvents, so they do not affect the environment, and the adhesion is completed after cooling and solidification. In addition, they also have the advantage of fast initial adhesion, so the demand is increasing day by day. . [0004] However, the existing thermoplastic hot-melt adhesives have problems of poor heat resistance, adhesive strength, and chemical resistance because the matrix used is a thermoplastic resin. [0005] However, the existing moisture-curing reactive adhesives can be cross-linked after being bonded, so their bonding strength is high, and the heat resistance is goo...

Claims

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Application Information

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IPC IPC(8): C09J175/06C09J175/08C08G18/76C08G18/66C08G18/42C08G18/48C08G18/10C08G18/32C08G18/38C08G18/30
Inventor 程瑶从赫雷方俊朗逸超
Owner 康达新材料(集团)股份有限公司
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