Single-ingredient diamond wire cutting fluid for silicon chip

Abstract

The invention discloses a preparation method of single-ingredient diamond wire cutting fluid for a silicon chip. The cutting fluid is prepared from the following ingredients in percentage by weight: 30 to 50 percent of block polyethers of PO-EO-PO structures, 6 to 15 percent of anti-foaming penetrants, 3 to 10 percent of non-silicon anti-foaming agents and the balance water. In the use process, the cutting fluid has the advantages of low foam, fast wetting, good silicon powder dispersion effect, few silicon chip line marks, low broken chip proportion, capability of easy discharged chip cleaning and the like; the qualification rate is greatly improved; the cutting qualification rate can reach 95 percent or higher.

Description

technical field [0001] The invention belongs to the technical field of silicon crystal cutting, in particular to a single-component diamond wire cutting fluid for silicon wafers. Background technique [0002] With the rapid development and progress of social science and technology, and the maturity of the solar photovoltaic industry, the demand for silicon wafers is growing rapidly. Slicing is the first step in the deep processing of silicon wafers. Since silicon wafers are hard materials, it is easy to cause stress, surface damage and edge chipping during the cutting process. Therefore, the cutting process occupies a very important position in the processing technology, and the performance of the cutting fluid It is one of the key factors affecting the efficiency and quality of the silicon wafer cutting process. [0003] At present, there are mainly two kinds of silicon wafer cutting processes, namely free mortar cutting suspension and diamond sand wire cutting. As a new ...

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Problems solved by technology

However, the addition of silicone defoamer will greatly reduce the storage stability of the cutting fluid on the one hand, and the silicone defoamer is easy to separate out and stratify; on the other hand, it will stick to the surface of the silicon wafer, forming white spots that are not easy to clean, affecting Photoelectric conversion efficiency of solar cells

In addition, in the diamond sand wire cutting process, the diamond coated on the outer layer of the sand wire and the silicon crystal are rubbed and cut, which will have a large friction force, and then generate an instantaneous high temperature; the silicon powder produced by the chip has a very fine particle size, and the specific surface area is greatly increased. It is easy to be adsorbed on the surface of the silicon wafer after cutting, and it is not easy to clean it off, so that the product smoothness is reduced, the damage is large, it is easy to warp, and the yield rate is reduced

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