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Ultrasonic effect evaluation component and method

An evaluation method, ultrasonic technology, applied in semiconductor/solid-state device testing/measurement, etc., can solve problems such as difficulty in obtaining accurate data, misjudgment of ultrasonic performance of ultrasonic cleaning equipment, and disputes

Inactive Publication Date: 2019-05-24
LONGI GREEN ENERGY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the differences between ultrasonic measuring instruments and the difficulty of obtaining accurate data by using ultrasonic measuring instruments to measure the strength of ultrasonic waves, misjudgments and disputes often occur in the determination of ultrasonic performance of ultrasonic cleaning equipment.

Method used

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  • Ultrasonic effect evaluation component and method
  • Ultrasonic effect evaluation component and method
  • Ultrasonic effect evaluation component and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] This embodiment provides an ultrasonic effect evaluation component for evaluating the ultrasonic effect of an ultrasonic cleaning device. This ultrasonic effect evaluation component includes at least one such as figure 1 The supporting frame 1 shown, and the membrane layer 2 arranged on the surface of the supporting frame 1 , preferably, the membrane layer 2 is detachably arranged on the surface of the supporting frame 1 . The ultrasonic cleaning device applies ultrasonic action to the membrane layer 2 .

[0031] The supporting frame 1 mainly plays a role of fixing and supporting the spreading of the film layer 2 , and it is a frame structure including an outer frame body 11 . The film layer 2 is fixed on the frame body 11 and at least partially covers the area surrounded by the frame body 11 , where the area is the hollow portion 12 inside the frame body 11 . The film layer 2 is laid to cover the hollow portion 12 and fixed to the frame portion 11. It should be point...

Embodiment 2

[0036] This embodiment provides another ultrasonic effect evaluation component, such as figure 2 and image 3As shown, two supporting frames 1 are included, and the film layer 2 is sandwiched between the two supporting frames 1 . Regarding the structural setting and manufacturing materials of the supporting frame 1, and the fixing method of the film layer 2 on the supporting frame 1, please refer to Embodiment 1, and details are not repeated here. It should be pointed out that the shape and size of the two support frames 1 can be consistent (same) or slightly different, but this difference should not affect the evaluation of the ultrasonic effect of the ultrasonic cleaning equipment.

[0037] The manufacturing method of this ultrasonic effect evaluation component can be roughly described as: taking two supporting frames 1; clamping the film layer 2 with the two supporting frames 1 and performing necessary fixing; cropped.

[0038] During the processing of silicon wafers, u...

Embodiment 3

[0041] This embodiment provides a specific ultrasonic effect evaluation component, which is used to evaluate the ultrasonic effect of ultrasonic cleaning equipment. The supporting frame 1 is made of stainless steel, the hollow part (inner frame) is 156mm×156mm in size, which is equivalent to the length and width of silicon wafers; the frame body (outer frame) is 170mm×170mm in size and 1mm thick, and is processed in the frame body 16 M5 threaded holes for locking tin foil. The tin foil should be the thickness of the packaging film. It is best to choose tin foil from the same manufacturer. Different manufacturers have different thickness and strength of tin foil, which will affect the test results. Two stainless steel support frames clamp the tin foil, cut off the excess tin foil with scissors, and then lock the stainless steel support frame with screws, and the ultrasonic effect evaluation component is completed. When fixing the tin foil, try to ensure that the test surface o...

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Abstract

An ultrasonic effect evaluation component disclosed by the invention is used to evaluate the ultrasonic effect of ultrasonic cleaning equipment. The ultrasonic effect evaluation component at least comprises support frames on which a film layer is arranged. The ultrasonic cleaning equipment exerts an ultrasonic effect on the film layer. An ultrasonic effect evaluation method disclosed by the invention is completed by using the ultrasonic effect evaluation component, and comprises the following steps: putting the ultrasonic effect evaluation component in the ultrasonic cleaning equipment for ultrasonic treatment; checking the surface of the film layer; and judging the ultrasonic effect of the ultrasonic cleaning equipment according to the condition of the surface of the film layer. The ultrasonic effect evaluation component of the invention has the advantages of simple manufacture and low input cost of consumables. The ultrasonic effect evaluation method is simple to operate and easy toimplement, and ordinary operators can quickly grasp the method only through simple training. The detection effect is intuitive. The cleaning ability of ultrasonic cleaning equipment from different manufacturers can be qualitatively judged, the ultrasonic effect of silicon wafer ultrasonic cleaning equipment can be reflected, and the silicon wafer cleaning ability of ultrasonic cleaning equipment can be judged.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer defect detection, and in particular relates to an ultrasonic effect evaluation component, and also relates to a method for evaluating the performance of ultrasonic cleaning equipment by using the component. Background technique [0002] With the continuous development of the world economy, the demand for high-efficiency energy in modernization is increasing. Photovoltaic power generation, as one of the main energy sources for green energy and sustainable development of human beings, has been increasingly valued and developed vigorously by countries all over the world. Monocrystalline silicon wafers and polycrystalline silicon wafers, as the basic materials of solar cells for photovoltaic power generation, have extensive market demand. According to the estimates of the International Energy Agency (IEA), it is expected that solar power will account for 16% of the global total power generation...

Claims

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Application Information

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IPC IPC(8): H01L21/66
Inventor 魏超锋邓浩谢志宴高攀红张超辛丽李瑛
Owner LONGI GREEN ENERGY TECH CO LTD
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