Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Contour-microcolumn-based open-type three-dimensional cell culture chip and preparation technique thereof

A three-dimensional cell and cell culture technology, applied in tissue cell/virus culture devices, microstructure technology, and processes for producing decorative surface effects, etc., can solve the problems of poor controllability, complex preparation methods, and uneven surface hardness. problem, to achieve the effect of good consistency, simple process steps, and easy micro-column height

Active Publication Date: 2019-05-28
NORTHWESTERN POLYTECHNICAL UNIV
View PDF22 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems of non-uniform surface hardness, complex preparation method and poor controllability of existing three-dimensional cell culture chips based on open structure, the present invention proposes an open three-dimensional cell culture chip based on contour micropillars and its preparation technology

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Contour-microcolumn-based open-type three-dimensional cell culture chip and preparation technique thereof
  • Contour-microcolumn-based open-type three-dimensional cell culture chip and preparation technique thereof
  • Contour-microcolumn-based open-type three-dimensional cell culture chip and preparation technique thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] In order to illustrate the cell culture chip described in this patent in more detail, an example is used below to describe the manufacturing method of the cell culture chip.

[0039] The chip in this example is used to culture SD rat bone marrow mesenchymal stem cells (rBMSCs).

[0040] Such as Figure 1 to Figure 3 As shown, the three-dimensional cell culture chip is made of PDMS material, including a substrate 1, a micropillar array 2 of equal height, a micropit 3 and a depression 4 formed on the upper surface of the micropillar array. The diameter L of the micropillar is 3 μm, the diameter R of the micropit 3 and the depression 4 is 20 μm, the depth r is 5 μm, the distance D between adjacent depressions is 12 μm, and the distance d between the microcolumns is 4 μm. The depressions 4 are arranged in a regular hexagon, that is, the center distance between any depression 4 and the adjacent depression 4 is the same fixed value D, and the center of the depression 4 in an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
depthaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a chip which can be applied to three-dimensional cell culture and a preparation technique thereof. The chip mainly comprises a contour microcolumn array 2 and a recess 4, wherein the recess 4 is formed at the top end face of the contour microcolumn array 2; the chip is prepared by MEMS (Micro-Electro-Mechanical System) and replication molding technologies. The chip and thepreparation technique thereof have the advantages that 1) the three-dimensional structure of the chip can provide functional three-dimensional growth conditions for cells, and can provide a substrate,uniform in hardness, for adhesion and spreading of the cells due to the contour microcolumn array 2; 2) the three-dimensional structure of the chip is open type, thereby being compatible with commonmicroscopic observation techniques; 3) a high-hardness material is used as a template substrate 6 during chip preparation, overcoming the problem that soft materials are easily damaged; 4) pits are formed in the template substrate through an isotropic micromachining technology, and the process controllability is high; 5) the microcolumn array is prepared by reaction of inductively coupled plasmas(ICP), the height of microcolumns is easy to control, and the defects such as lodging due to overlarge depth-to-width ratio of the microcolumns are avoided.

Description

technical field [0001] The invention relates to a cell culture chip with an open three-dimensional structure and its preparation technology. Background technique [0002] Traditional cell culture technology can only provide a flat two-dimensional surface for cell spreading and growth, but this two-dimensional surface is far from the growth environment of cells in the body, resulting in changes in cell shape and function, such as: Osteoblasts do not have the ability to proliferate in vivo, but if they are isolated and cultured using traditional two-dimensional methods, they have the ability to proliferate. [0003] In view of the limitations of the above-mentioned two-dimensional cell culture technology, people have proposed a three-dimensional cell culture technology: using a three-dimensional structure of biological scaffolding materials to cultivate cells, so that cells can grow, proliferate and migrate in three-dimensional space, forming a three-dimensional cell-cell or ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C12M3/00C12M1/00B81C1/00
Inventor 叶芳梁浩彬撒成花闫志强王健谢丽常洪龙苑伟政
Owner NORTHWESTERN POLYTECHNICAL UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com