Double-sided water-cooling heat dissipation structure of high-power-density IGBT module and processing technology

Abstract

The invention relates to a double-sided water-cooling heat dissipation packaging structure of a high-power-density IGBT module and a processing technology. The double-sided water-cooling heat dissipation packaging structure comprises IGBT subunits, diode subunits, a copper-clad ceramic substrate, a buffer gasket, a solder layer, a heat-conducting silicone grease layer, a graphene heat dissipationlayer and an upper and lower water-cooling plate radiator. The graphene heat dissipation layer takes the surface of the chip transferred to an appointed position as a rapid transverse heat dissipationlayer, and local heat of the chip is rapidly and transversely spread, so that rapid cooling of a local hot spot is realized. The double-sided water-cooling heat dissipation packaging structure is easy to manufacture and high in flexibility, uneven heat dissipation of the water-cooling radiator can be effectively relieved, and therefore the reliability and the service life of the device are improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a double-sided water-cooled heat dissipation structure and a processing technology of a high-power-density IGBT module. Background technique [0002] Insulated Gate Bipolar Transistor (IGBT) is a composite full-control voltage-driven power semiconductor device composed of a metal-oxide semiconductor field-effect transistor and a fast diode. It combines the advantages of MOSFET and FRD and has fast switching speed. , high input impedance, short reverse recovery time, good thermal stability, on-state voltage drop, high voltage and other characteristics, widely used in wind energy, solar energy, rail transit, electric vehicles, smart grid, home appliance frequency conversion fields, etc., has become a power The mainstream of semiconductor devices. With the continuous breakthrough of new technology and new process, and the improvement of power level, the applicati...

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Problems solved by technology

[0004] In order to solve the problems of the prior art, the object of the present invention is to overcome the deficiencies of the prior art, provide a new heat dissipation structure and processing technology of the IGBT module, and apply the graphene material to the IGBT chip with a high heat flux density in the form of a heat dissipation film Solve the problem of uneven heat dissipation of press-fit double-sided water cooling

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