A kind of epoxy resin base composite insulating material and preparation method thereof
A technology of epoxy resin and composite insulation, applied in the direction of plastic/resin/wax insulators, organic insulators, etc., can solve the problem of low breakdown field strength of composite insulation materials, and achieve stable DC breakdown field strength, homogenized electric field, The effect of ensuring the stability of operation
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Embodiment 1
[0031] An epoxy resin-based composite insulating material, comprising the following components in parts by mass: 1.45-4.09 parts of silicon carbide nanoparticles, 0.47 parts of hexagonal boron nitride sheet, 25 parts of epoxy resin, 22 parts of curing agent and 0.03 parts of accelerator .
Embodiment 2
[0033] An epoxy resin-based composite insulating material, comprising the following components in parts by mass: 1.45-4.09 parts of silicon carbide nanoparticles, 0.47 parts of hexagonal boron nitride sheet, 25 parts of epoxy resin, 22 parts of curing agent and 0.03 parts of accelerator .
[0034] In this embodiment, the particle size of the silicon carbide nanoparticles is 30-50 nm, the thickness of the hexagonal boron nitride sheet is 80-150 nm, and the diameter is 3-5 μm.
Embodiment 3
[0036] An epoxy resin-based composite insulating material, comprising the following components in parts by mass: 1.45-4.09 parts of silicon carbide nanoparticles, 0.47 parts of hexagonal boron nitride sheet, 25 parts of epoxy resin, 22 parts of curing agent and 0.03 parts of accelerator , wherein the silicon carbide nanoparticles have a particle size of 30-50 nm, the hexagonal boron nitride sheet has a thickness of 80-150 nm, and a diameter of 3-5 μm.
[0037] In this embodiment, the epoxy resin is E-51 type phenolic propane polyester resin, E-44 type epoxy resin, bisphenol A type epoxy resin, polyphenol type glycidyl ether epoxy resin or glycidyl ester type One of the epoxy resins; the curing agent is methyl hexahydrophthalic anhydride, and the accelerator is 2-ethyl-4-methylimidazole.
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