A microstrip patch filter

A microstrip patch and filter technology, applied in the field of filters, can solve the problems of poor thermal conductivity of epoxy resin, brittleness, poor heat dissipation, and low shrinkage rate, and achieve simple structure, improved high temperature resistance, and heat transfer. quick effect

Active Publication Date: 2019-12-17
深圳市阿赛姆电子有限公司
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy resin is used in the field of high temperature protection materials because of its good bonding strength, low shrinkage rate, good electrical insulation, and low expansion rate. However, epoxy resin has poor thermal conductivity, brittleness and heat dissipation. However, the shortcomings such as poor performance cannot be really applied to the field of thermal conductivity materials.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A microstrip patch filter
  • A microstrip patch filter
  • A microstrip patch filter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.

[0037] In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be mechanical connection or electrical connection, or two The internal communication of each element may be directly connected or indirectly connected through an intermediary...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
specific surface areaaaaaaaaaaa
Login to view more

Abstract

The invention relates to a filter, and particularly relates to a microstrip patch filter. The microstrip patch filter comprises a filter cavity, an outer casing and an inner casing, wherein a ventilation pipeline is arranged in the outer casing, a heat dissipation layer is arranged in the inner casing, a heat absorption layer is arranged on the inner surface of the heat dissipation layer, two fixed cavities are arranged on both sides of the outer casing, a microstrip patch is fixed above the fixed cavities, two ventilation valves are arranged under the fixed cavities and are used for controlling the incoming and outgoing of gas in the ventilation pipeline, a groove is formed between the fixed cavities and the filter cavity, a through-line pipe communicated with the filter cavity and the microstrip patch is arranged in the groove, and a base is also arranged at the bottom of the filter cavity. The filter provided by the invention is simple in structure, performs combined heat dissipation by using the heat absorption layer, the heat dissipation layer, the ventilation pipeline and other methods, and can greatly enhance the heat dissipation performance of the filter.

Description

technical field [0001] The invention relates to a filter, in particular to a microstrip patch filter. Background technique [0002] A filter is a radio frequency device that passes useful signals without attenuation as much as possible and attenuates useless signals as much as possible; it is generally installed in the signal transceiver device or circuit part of communication equipment to realize the selection of communication equipment signals. Generally, the filter is mainly composed of a filter cavity and a cover plate. There are multiple resonant rods in the filter cavity. One end of the tuning screw penetrates the cover plate and is opposite to the resonant rod. The adjustment tool adjusts the distance between the tuning screw and the resonant rod. The distance between them to achieve the required RF index. [0003] A microstrip filter is a device used to separate microwave signals of different frequencies. Its main function is to suppress unwanted signals so that th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/207C08L63/00C08K9/04C08K7/24H05K7/20
Inventor 孙磊许海财陈伦森
Owner 深圳市阿赛姆电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap