A polysilicon ingot silicon wafer cleaning equipment

Abstract

The invention relates to a polysilicon ingot cleaning equipment, including a processing box, a polishing rod, a driving machine, a rotating shaft, an inner box, a water collection tank, a pump body, a motor one, a pulley, a transmission shaft, a rope, a motor two, a bracket, High-pressure nozzle, slider, rack, gear and installation shaft, the rotating shaft is connected to the inside of the processing box, and is connected to the output end of the driving machine, the polishing rod is set on the rotating shaft, the inner box is located above the water collection tank, and two pulleys The symmetrical rotation is connected to the transmission shaft, the pulley is fixedly connected to the inner box through the rope, the transmission shaft is connected to the output end of the motor 1, the rack is connected to the inside of the processing box through the slider, and the gear is connected to the processing box through the installation shaft. Inside the body, the high-pressure nozzle is fixedly connected to the rack through the bracket. The invention has excellent structure, reasonable design, easy operation, eliminates dead corners of polishing, and combines polishing and cleaning into one. It has wide application prospects and strong creativity.

Description

technical field [0001] The invention relates to the field of silicon wafer cleaning equipment, in particular to a polycrystalline silicon ingot silicon wafer cleaning equipment. Background technique [0002] Silicon wafers must be strictly cleaned in the production of semiconductor devices. Trace contamination can also lead to device failure. The purpose of cleaning is to remove surface contamination impurities, including organic and inorganic substances. Some of these impurities exist in the atomic state or ion state, and some exist in the form of thin films or particles on the surface of the silicon wafer. lead to various defects. There are two ways to remove pollution, physical cleaning and chemical cleaning. [0003] Physical cleaning is one of the cleaning methods. Physical cleaning often uses high-pressure nozzles to clean silicon wafers. However, in traditional silicon wafer processing, cleaning equipment and polishing equipment belong to two types of equipment. T...

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Problems solved by technology

[0004] The object of the present invention is to provide a polysilicon ingot silicon wafer cleaning equipment to solve the traditional silicon wafer processing proposed in the above background technology. The cleaning equipment and the polishing equipment belong to two types of equipment, which are processed successively, prolonging the processing time. The matching degree is low, and during the polishing process, the position of the processing box is fixed, and the polishing will leave a dead angle, resulting in the problem of incomplete polishing

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