Flexible V2O5/Ge2Sb2Te5 nanometer multilayer phase-change thin film material and preparation method thereof
A nano-multilayer, thin-film material technology, applied in metal material coating process, coating, ion implantation plating and other directions, can solve the problems of differential thermal stability, low crystallization temperature, etc., to achieve good thermal stability, fast phase The effect of variable speed and high data retention capability
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Embodiment 1
[0032] [V 2 o 5 (1) / Ge 2 Sb 2 Te 5 (9)] The preparation of 5 nanometer multilayer thin film phase change material is as follows:
[0033] (1) Cleaning mica slices: Ultrasonic cleaning in ethanol solution for 50-60 minutes, rinsing with deionized water, high-purity N 2 Dry the surface and the back; dry the water vapor in an oven at 150°C until the surface is dry; set aside;
[0034] (2) Preparation before magnetron sputtering: place the mica sheet in step (1) on the base, install the V to be sputtered 2 o 5 Target and Ge 2 Sb 2 Te 5 target, the magnetron sputtering chamber was evacuated to 1 × 10 -4 Pa, using high-purity Ar gas as the sputtering gas; set the sputtering power to 30W; set the Ar gas flow to 30 sccm, and adjust the sputtering pressure to 0.40Pa.
[0035] (3) preparation [V 2 o 5 (1) / Ge 2 Sb 2 Te 5 (9)] 5 nanometer multilayer thin film phase change material:
[0036] a) Rotate the empty base to V respectively 2 o 5 Target and Ge 2 Sb 2 Te 5 ta...
Embodiment 2
[0041] [V 2 o 5 (3) / Ge 2 Sb 2 Te 5 (7)] the preparation method of 5 nanometer multilayer film phase-change material is identical with embodiment 1, difference is: set Ge in step (3) b, c 2 Sb 2 Te 5 Target sputtering time 12s, V 2 o 5 The sputtering time of the target is 150s.
Embodiment 3
[0043] [V 2 o 5 (5) / Ge 2 Sb 2 Te 5 (5)] The preparation method of 5 nanometer multilayer film phase-change material is identical with embodiment 1, difference is: set Ge in step (3) b, c2 Sb 2 Te 5 The sputtering time of the target is 8s, V 2 o 5 The sputtering time of the target is 250s.
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