a flexible v 2 o 5 /ge 2 sb 2 te 5 Nano multilayer phase change thin film material and preparation method thereof
A nano-multilayer, thin-film material technology, applied in metal material coating process, coating, vacuum evaporation plating and other directions, can solve the problems of differential thermal stability, low crystallization temperature, etc., to achieve good thermal stability, fast phase The effect of variable speed and high data retention capability
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Embodiment 1
[0032] [V 2 O 5 (1) / Ge 2 Sb 2 Te 5 (9)] The preparation of the 5-nanometer multilayer thin film phase change material is as follows:
[0033] (1) Cleaning mica flakes: ultrasonically clean in ethanol solution for 50-60 minutes, rinse with deionized water, high-purity N 2 Dry the surface and back; dry the water vapor in an oven at 150°C until the surface is dry; set aside;
[0034] (2) Preparation before magnetron sputtering: place the mica sheet in step (1) on the base, install the V to be sputtered 2 O 5 Target and Ge 2 Sb 2 Te 5 target, vacuum the magnetron sputtering chamber to 1×10 -4 Pa, use high-purity Ar gas as the sputtering gas; set the sputtering power to 30W; set the Ar gas flow to 30sccm, and adjust the sputtering gas pressure to 0.40Pa.
[0035] (3) Preparation [V 2 O 5 (1) / Ge 2 Sb 2 Te 5 (9)] 5nm multilayer thin film phase change material:
[0036] a) Rotate the empty base to V respectively 2 O 5 Target and Ge 2 Sb 2 Te 5 target, open V 2 O...
Embodiment 2
[0041] [V 2 O 5 (3) / Ge 2 Sb 2 Te 5 (7)] The preparation method of the 5-nanometer multi-layer thin film phase change material is the same as that of Example 1, except that: Ge is set in steps (3) b and c. 2 Sb 2 Te 5 Target sputtering time 12s, V 2 O 5 The sputtering time of the target is 150s.
Embodiment 3
[0043] [V 2 O 5 (5) / Ge 2 Sb 2 Te 5 (5)] The preparation method of the 5-nanometer multilayer thin film phase change material is the same as that in Example 1, the difference is that Ge is set in steps (3) b and c.2 Sb 2 Te 5 Target sputtering time 8s, V 2 O 5 The sputtering time of the target is 250s.
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