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Process for producing thin coatings on film

A coating, coating technology used in coatings, sustainable manufacturing/processing, devices for applying liquids to surfaces, etc., that can solve problems such as economic feasibility, complexity and capital cost slowing down widespread adoption in the packaging industry

Pending Publication Date: 2019-06-25
DOW GLOBAL TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the economic viability and / or added complexity and capital cost of these approaches can ultimately slow their widespread adoption by the packaging industry

Method used

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  • Process for producing thin coatings on film
  • Process for producing thin coatings on film
  • Process for producing thin coatings on film

Examples

Experimental program
Comparison scheme
Effect test

example

[0063] Use the following scheme to dip-coat silicon wafers [assumed to be inflexible. Any example uses zinc oxide (ZnO) on a flexible substrate]:

[0064] (1) Prepare a 1M solution of diethyl zinc (DEZ) in anhydrous pentane.

[0065] (2) Place the test silicon wafer in a 4-ounce dried glass bottle. Add 2 mL of DEZ solution to the bottle. The Si wafer was allowed to stand in the DEZ solution for 10 minutes.

[0066] (3) Use Teflon tweezers to transfer the wafer to a clean bottle and rinse the wafer three times with fresh pentane. A washing step is incorporated to grow a very thin layer in a certain time.

[0067] (4) Cap the bottle and take the sample out of the glove box. Carefully open the bottle in a fume hood and expose the sample to air for 5 minutes.

[0068] (5) Put the sample back into the glove box and repeat steps 1 to 4 until the required number of cycles are performed.

[0069] figure 1 Displays the measured ellipsometric film thickness as a function of the number of coa...

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PUM

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Abstract

Conventional atomic layer deposition technology is modified to increase its cost-effective viability for use in producing thinly coated flexible packaging film. In one embodiment a thinly coated flexible substrate, e.g., a polyolefin film, is made by a process comprising the steps of: (A) Dissolving a self-limiting precursor in a solvent to form a solution of dissolved self-limiting precursor in the solvent, (B) Applying the solution to a facial surface of a flexible polymer film so that at least a portion of the dissolved self-limiting precursor attaches to the facial surface of the film andthe solution is at least partially depleted of self-limiting precursor, and (C) Curing the attached self-limiting precursor by contact with oxygen

Description

Technical field [0001] The present invention relates to a flexible packaging film with high oxygen barrier and high moisture resistance and a solution-based method for manufacturing the film. The product of the method includes a flexible film substrate with a thin coating on the film substrate. In one aspect, the present invention relates to a solution-based atomic layer deposition (ALD) method for producing inorganic or inorganic hybrid coatings on polymeric film substrates, while in another aspect, the present invention relates to the method The flexible package. Background technique [0002] A variety of food, medical and pharmaceutical packaging applications require high barrier film materials, and aluminum foil is currently the main choice for this market. The packaging industry is looking for alternatives to aluminum foil with similar or better barrier properties, such as an oxygen transmission rate (OTR) of 0.05 cubic centimeters (cubic) per 100 square inches per day at ...

Claims

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Application Information

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IPC IPC(8): C08J7/06C08J7/048
CPCC08J7/06C08J2323/00C08J2323/06C08J7/048B05D3/046B05D7/26C08F110/02C09D5/00C09D123/06
Inventor J·阿拉波松J·墨菲饶袁桥C·塞拉特
Owner DOW GLOBAL TECH LLC