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A kind of hot-melt adhesive film for UV curing type flexible flat cable and preparation method thereof

A hot-melt adhesive film, flexible and flat technology, applied in the field of circuit board processing, can solve the problems of conductor offset, slow pressing speed, hot-melt adhesive film overflow, etc., to achieve excellent anti-overflow adhesive performance, reduced fluidity, and storage long term effect

Active Publication Date: 2022-01-11
广东莱尔新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current hot-melt adhesive film for UV-curable flexible flat cables has the following problems: 1. The softening point of the hot-melt adhesive film is high. The softening point is usually 20-60°C higher
The higher the softening point, the higher the pressing temperature, the slower the pressing speed and the low efficiency
2. The hot-melt adhesive film is a thermoplastic material. During long-term use, the hot-melt adhesive film is prone to overflow to the surface of the conductor, resulting in insulation
3. During the process of attaching the hot-melt shielding material to the formed wire, the hot-melt adhesive film softens again, which is prone to the problems of conductor offset and hot-melt adhesive film overflow

Method used

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  • A kind of hot-melt adhesive film for UV curing type flexible flat cable and preparation method thereof
  • A kind of hot-melt adhesive film for UV curing type flexible flat cable and preparation method thereof
  • A kind of hot-melt adhesive film for UV curing type flexible flat cable and preparation method thereof

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preparation example Construction

[0042] The preparation method of the above-mentioned UV curing type flexible flat cable with hot-melt adhesive film, comprises the following steps:

[0043] Step 1: Resin is dissolved; add 80-120 parts of acrylic modified saturated polyester and 100-180 parts of toluene into the reaction kettle, heat up to 60-80°C, stir, and control the stirring speed at 500-1000r / min to disperse and dissolve;

[0044] Step 2: Paint dispersion and grinding; add 60-100 parts of flame retardant, 1-3 parts of titanium dioxide, 0.5-5 parts of fumed silica into the resin dispersion, add 60-100 parts of toluene solvent, 1000-2000r / min Stir and disperse evenly, and grind until the fineness is less than 10um;

[0045] Step 3: Stir further; add 0.5-5 parts of photoinitiator, continue stirring at 500-1000r / min to disperse evenly;

[0046] Step 4: coating; the hot melt adhesive film obtained above is evenly coated on the PET base film or PI film, and dried at 70-160°C, and the production process is prot...

Embodiment 1

[0049] raw material Proportion Acrylic Modified Saturated Polyester 1 100 copies Toluene solvent 180 servings photoinitiator 3 copies flame retardant 80 servings Titanium dioxide 3 copies Fumed silica 5 servings

Embodiment 2

[0051] raw material Proportion Acrylic Modified Saturated Polyester 1 100 copies Toluene solvent 180 servings photoinitiator 0.5 servings flame retardant 80 servings Titanium dioxide 3 copies Fumed silica 5 servings

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Abstract

A UV-curable hot-melt adhesive film for flexible flat cables is mainly made of acrylic modified saturated polyester; and a certain amount of toluene solvent, photoinitiator, flame retardant, titanium dioxide and fumed silica are used. The ratio of parts by weight of each component case of the hot melt adhesive film is as follows: 80-120 parts of acrylic modified saturated polyester; 160-280 parts of toluene solvent; 1-5 parts of photoinitiator; 60-100 parts of flame retardant 1-3 parts of titanium dioxide; 0.5-5 parts of fumed silica. The saturated polyester is modified by acrylic acid, which can be used at room temperature, and cross-linked and cured by UV lamps. The reaction speed is fast and the storage period is long.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a UV-curable hot-melt adhesive film for flexible flat cables and a preparation method thereof. Background technique [0002] The current hot-melt adhesive film for UV-curable flexible flat cables has the following problems: 1. The softening point of the hot-melt adhesive film is high. The softening point is usually 20-60°C higher. The higher the softening point, the higher the pressing temperature, and the slower the pressing speed, the lower the efficiency. 2. The hot-melt adhesive film is a thermoplastic material. During long-term use, the hot-melt adhesive film is prone to overflow to the surface of the conductor, resulting in insulation. 3. In the process of attaching the hot-melt shielding material to the formed wire, the hot-melt adhesive film softens again, which is prone to the problems of conductor offset and hot-melt adhesive film overflow. Contents...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/35C09J151/08C09J11/06C09J11/04
Inventor 李政贺才利张潮
Owner 广东莱尔新材料科技股份有限公司
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