120-180 degree heat dissipation and non-side-leakage liquid metal heat interface material

A technology of thermal interface materials and liquid metals, applied in the field of indium alloys, can solve problems such as no solutions, and achieve the effects of low production costs, large market value, and simple processing and smelting methods

Inactive Publication Date: 2019-07-02
杭州辰卓科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Countries have invested a lot of manpower and physics in in-depth research, but there is no relatively mature solution

Method used

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  • 120-180 degree heat dissipation and non-side-leakage liquid metal heat interface material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A liquid metal thermal interface material with 120-180 degree heat dissipation and no side leakage. In terms of weight percentage, the composition of the alloy is: Al: 0.5wt.%, Co: 0.2wt.%, Ga: 1.0wt.%, V: 0.2wt.%, Zn: 28.0wt.%, Ge: 1.5wt. %, Sb: 3.0wt.%, the balance is indium.

[0018] The preparation method of the above-mentioned heat dissipation material includes the following processing steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting, and is protected by a graphite crucible and argon; heat preservation at 300-400 degrees for 10 minutes After the alloy melt is fully stirred evenly by electromagnetic stirring, it is introduced into the graphite mold for casting; (b) The ingot is cold-rolled, and the reduction of each rolling pass is 10-20% until the required rolling is achieved. Thickness (0.1-0.5mm).

[0019] The melting point of the matrix phase of the material is 190 degrees, while the...

Embodiment 2

[0021] A liquid metal thermal interface material with 120-180 degree heat dissipation and no side leakage. In terms of weight percentage, the composition of the alloy is: Al: 1.0wt.%, Co: 0.4wt.%, Ga: 1.5wt.%, V: 0.4wt.%, Zn: 34.0wt.%, Ge: 2.0wt. %, Sb: 4.0wt.%, the balance is indium.

[0022] The preparation method of the above-mentioned heat dissipation material includes the following processing steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting, and is protected by a graphite crucible and argon; heat preservation at 300-400 degrees for 10 minutes After the alloy melt is fully stirred evenly by electromagnetic stirring, it is introduced into the graphite mold for casting; (b) The ingot is cold-rolled, and the reduction of each rolling pass is 10-20% until the required rolling is achieved. Thickness (0.1-0.5mm).

[0023] The matrix phase of the material has a melting point of 210 degrees, while the ...

Embodiment 3

[0025] A liquid metal thermal interface material with 120-180 degree heat dissipation and no side leakage. In terms of weight percentage, the composition of the alloy is: Al: 0.8wt.%, Co: 0.3wt.%, Ga: 1.2wt.%, V: 0.3wt.%, Zn: 28.5wt.%, Ge: 1.8wt. %, Sb: 3.2wt.%, the balance is indium.

[0026] The preparation method of the above-mentioned heat dissipation material includes the following processing steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting, and is protected by a graphite crucible and argon; heat preservation at 300-400 degrees for 10 minutes After the alloy melt is fully stirred evenly by electromagnetic stirring, it is introduced into the graphite mold for casting; (b) The ingot is cold-rolled, and the reduction of each rolling pass is 10-20% until the required rolling is achieved. Thickness (0.1-0.5mm).

[0027] The melting point of the matrix phase of the material is 210 degrees, while the...

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Abstract

The invention discloses a 120-180 degree heat dissipation and non-side-leakage liquid metal heat interface material. The 120-180 degree heat dissipation and non-side-leakage liquid metal heat interface material is prepared from the components in percentage by weight: 0.5-1.0wt.% of Al, 0.2-0.4wt.% of Co, 1.0-1.5wt.% of Ga, 0.2-0.4wt.% of V, 28.0-34.0wt.% of Zn, 1.5-2.0wt.% of Ge, 3.0-4.0wt.% of Sb, and the balance of indium. According to the 120-180 degree heat dissipation and non-side-leakage liquid metal heat interface material, the problem that side leakage can occur in common liquid metalsis solved, and meanwhile, a beneficial liquid metal heat interface material is provided for the field of electronic industry which is in urgent need of efficient heat dissipation. It can be predictedthat great social value and economic value can be certainly obtained through successful industrialization of the 120-180 degree heat dissipation and non-side-leakage liquid metal heat interface material.

Description

technical field [0001] The invention relates to the technical field of alloys, in particular to an indium alloy. Background technique [0002] With the rapid development of science and technology, the requirements for electronic devices are getting higher and higher. At the same time, electronic devices are also developing in the direction of integration and miniaturization. At the same time, high reliability, flexibility, compactness and easy maintenance are required. This demand brings new challenges to the materials used in electronic devices, manufacturing processes and electronic circuits. The miniaturization and high power of devices inevitably require high heat dissipation efficiency, so high-density heat dissipation seriously restricts the development of power electronics technology. Internationally, more stringent requirements have been put forward for the heat dissipation of electronic power devices. [0003] A cooling system can be simply summarized into two p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C28/00C22C1/02
CPCC22C1/02C22C28/00
Inventor 刘亚军
Owner 杭州辰卓科技有限公司
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