A method for measuring semiconductor thermal resistance

Abstract

The present invention relates to the technical field of integrated circuits, in particular to a method for measuring the thermal resistance of a semiconductor, which includes, step S1, providing a data collection system, the data collection system includes a recorder, and the recorder pre-records the ambient temperature of the embedded system; step S2 , Turn off the temperature control of the embedded system, so that the embedded system runs at a preset operating frequency to test the temperature difference of the CPU of the embedded system; Step S3, the recorder records the power supply voltage and the corresponding power supply related to the integrated chip of the embedded system voltage and current, and record the power supply voltage and the current and temperature difference corresponding to the power supply voltage in the thermal resistance parameter table; step S4, compare the thermal resistance between different heat dissipation materials by comparing the thermal resistance parameter table. Beneficial effects: through multi-point measurement, the measurement accuracy is high, manpower is saved, the power consumption of the whole machine and the power consumption data of each branch are recorded, the calculation is convenient, the best heat dissipation material can be found, and the chip manufacturing cost is reduced.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a method for measuring semiconductor thermal resistance. Background technique [0002] With the increasing role of domestic integrated circuits, the requirements for their reliability are also getting higher and higher, and the accurate and quick measurement of the thermal resistance from junction to case and the thermal parameters on the main heat conduction path is to ensure its reliability. critical step in sexuality. [0003] By measuring the shell temperature of the chip and the temperature of the air environment around the chip, the method of measuring the power consumption of the chip can be obtained, but the equipment is expensive, the algorithm is complicated, and the cost is high. Therefore, it is not popularized and the scope of use is limited. Contents of the invention [0004] Aiming at the above-mentioned problems existing in the prior art, a method f...

AI Technical Summary

Problems solved by technology

[0003] By measuring the shell temperature and the temperature of the air environment around the chip when the chip is working, the method of measuring the power consumption of the chip can be obtained, but the equipment is expensive, the algorithm is complicated, and the cost is high. Therefore, it is not popularized and the scope of use is limited.

Images