Apparatus for collecting by-product in semiconductor process

Abstract

Disclosed is an apparatus for collecting a by-product in a semiconductor process, the apparatus including: a housing; a heater plate; a heater power supply unit; first and second upper horizontal brackets collecting a by-product; a by-product collecting tower allowing the exhaust gas to pass through an exhaust gas passing space and collecting the by-product; the lower horizontal bracket guiding the exhaust gas toward the window and collecting the by-product contained in the exhaust gas; the window blocking the powder form by-product from introducing to a gas collecting and discharging port andguiding the exhaust gas thereto; and the gas collecting and discharging port. Accordingly, the apparatus can increase capacity of collecting a by-product with a simple structure, thereby extending areplacement period of the apparatus. In addition, the apparatus can collect a large amount of by-products quickly and efficiently over a long period of time.

Description

technical field [0001] The present invention relates to a device for capturing by-products of a semiconductor process, and more specifically, to a device for capturing more efficiently and in large quantities reaction by-products contained in waste gas discharged from a process chamber in a semiconductor element manufacturing process and safely Semiconductor process by-product capture device invented for processing. Background technique [0002] Generally speaking, the semiconductor manufacturing process is roughly composed of a pre-process (Fabrication, manufacturing process) and a post-process (Assembly, assembly process). The process of depositing a thin film on Wafer and selectively etching the deposited film to process a specific pattern, and by means of this process to manufacture a semiconductor chip (Chip). The so-called post-process refers to individually separating the chips manufactured in the previous process. Finally, it is combined with the lead frame to assem...

AI Technical Summary

Problems solved by technology

As a result, the amount of unreacted by-products increases, and a capture device that can capture a large amount of by-products is required. Conventional low-capacity capture devices have exposed a large number of problems due to the increased number of process chamber shutdowns required for cleaning. Therefore, it is required to be able to prolong cleaning Periodic high-capacity semiconductor by-product capture device

[0013] On the other hand, when simply enlarging the by-product collection device of the semiconductor manufacturing device proposed in the aforementioned Korean Patent Publication No. 10-0647725 and No. 10-0676927, the production of the spiral plate is difficult, and the production unit price is greatly increased. With the application of a double shell due to the cooling water of the shell, as the tube (Tube) that becomes the cylindrical shell material increases, the production unit price rises sharply. In addition, compared with the total area, there is a real trap due to the complicated internal structure and structures. Set space reduction and other issues