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Microwave heating, ultrasonic vibration and mechanical overturning combined dismounting electronic component device

A technology of electronic components and ultrasonic vibration, which is applied in the fields of mechanical flipping and composite dismantling of electronic components, ultrasonic vibration, and microwave heating. Fast and easy to promote the effect

Pending Publication Date: 2019-07-12
ARMOR ACADEMY OF CHINESE PEOPLES LIBERATION ARMY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method has the disadvantages that the components are easy to fall into the liquid, it is difficult to clean, and the heating process is easy to generate harmful gases.

Method used

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  • Microwave heating, ultrasonic vibration and mechanical overturning combined dismounting electronic component device
  • Microwave heating, ultrasonic vibration and mechanical overturning combined dismounting electronic component device
  • Microwave heating, ultrasonic vibration and mechanical overturning combined dismounting electronic component device

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] see Figure 1-3 , Microwave heating, ultrasonic vibration, mechanical flip composite dismantling device for electronic components, including microwave heating system, ultrasonic vibration system and mechanical flip system;

[0028] The microwave heating system includes a heating box 1, a microwave launcher 2 and a waveguide 3, and the microwave launcher 2 includes components such as a magnetron, an energy-feeding waveguide, a power supply, and a tempera...

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Abstract

The invention relates to the technical field of electronic component recovery, and discloses a microwave heating, ultrasonic vibration and mechanical overturning combined dismounting electronic component device. The device comprises a microwave heating system, an ultrasonic vibration system and a mechanical overturning system. According to the device, three methods of microwave heating, ultrasonicvibration and mechanical overturning are comprehensively integrated; soldering tin in a molten state after being subjected to microwave heating is deposited on a conical blow-off valve under the effects of ultrasonic vibration and mechanical overturning and is naturally separated from a liquid medium; under the effects of ultrasonic vibration and mechanical overturning, electronic components falloff from a waste circuit board and then are accumulated in a metal mesh screen, and along with the overturning of the metal mesh screen, the waste circuit board is brought upward and then falls; andwith the buoyancy of heat conduction oil and the isolation of a buffer shaft, the floating time of the waste circuit board is prolonged to the maximum extent, the effect of a micro-explosion shock wave acting on the waste circuit board is improved, and the removal and dismounting rate of electronic elements is further improved.

Description

technical field [0001] The invention relates to the technical field of recycling electronic components, in particular to a device for compositely dismantling electronic components by microwave heating, ultrasonic vibration, and mechanical flipping. Background technique [0002] Waste circuit boards contain a large number of components. Some components have long life and high reliability. Through disassembly, testing and reuse, the recycling value of electronic components on waste circuit boards can be greatly improved and environmental pollution can be reduced. [0003] Most of the electronic components on the circuit board are connected to the circuit board in the form of solder. Therefore, to realize the disassembly and recycling of electronic components on the waste circuit board, the first task is to remove the solder on the waste circuit board. It is one of the difficulties in the current recycling of electronic components to remove the solder without damaging the elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B09B3/00B09B5/00
CPCB09B5/00B09B3/40Y02W30/82
Inventor 唐修检刘谦漆陪部
Owner ARMOR ACADEMY OF CHINESE PEOPLES LIBERATION ARMY
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