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Display panel and manufacturing method thereof

A technology for display panels and preparation steps, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of low screen ratio, poor encapsulation effect of the encapsulation film layer, and poor water and oxygen blocking effect, etc. Screen-to-body ratio, enhanced performance, and extended service life

Active Publication Date: 2020-09-08
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to solve the technical problems caused by laser cutting in the existing display panel opening process, such as particle adhesion to the cutting edge, poor effect of blocking water and oxygen, poor encapsulation effect of packaging film layer, and low screen-to-body ratio.

Method used

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  • Display panel and manufacturing method thereof
  • Display panel and manufacturing method thereof
  • Display panel and manufacturing method thereof

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Experimental program
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Effect test

Embodiment 1

[0044] like figure 1 As shown, this embodiment provides a method for manufacturing a display panel, including steps S101-S107.

[0045] S101 substrate setting step, the substrate setting step includes steps S111~S113 (see figure 2 ), S111 substrate layer preparation step, prepare a substrate layer 2 on the upper surface of the substrate 1, the substrate layer 2 is made of polyimide (PI) or other buffer material, which plays the role of buffer protection. S112 TFT layer preparation step, preparing a TFT layer 3 on the upper surface of the substrate layer 2 . S113 opening step, opening holes downward on the upper surface of the thin film transistor layer 3 to form a through hole 31 (see image 3 ), the inner diameter of the through hole 31 gradually decreases from top to bottom, presenting a platform-shaped through hole structure.

[0046] S102 photoresist preparation step, preparing a photoresist 4 in the through hole 31, the photoresist preparation step includes steps S121-S...

Embodiment 2

[0066] like Figure 11 As shown, this embodiment provides a method for manufacturing a display panel, including steps S201-S207.

[0067] S201 substrate setting step, the substrate setting step includes steps S211 to S213 (see Figure 12 ), S211 substrate layer preparation step, prepare substrate layer 2 on the upper surface of substrate 1, the material of substrate layer 2 is polyimide (PI) or other buffer material, play the effect of buffer protection. Step S212 of preparing a thin film transistor layer, preparing a thin film transistor layer 3 on the upper surface of the substrate layer 2 . S213 opening step, opening holes downward on the upper surface of the thin film transistor layer 3 to form through holes 31 (see image 3 ), the inner diameter of the through hole 31 gradually decreases from top to bottom, presenting a platform-shaped through hole structure.

[0068] S202 photoresist preparation step, preparing photoresist 4 in the through hole 31, the photoresist pre...

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Abstract

The present invention provides a display panel and a preparation method thereof. The preparation method of the display panel includes the following steps: a substrate setting step, a photoresist preparation step, a protective layer preparation step, a first inorganic layer preparation step, an organic layer preparation step and a second The second inorganic layer preparation step, before or after the first inorganic layer preparation step, further includes a photoresist removal step for removing the photoresist in the through hole and the cathode layer and protective layer thereon. The technical effect of the present invention is that it does not need to use laser cutting, avoids the technical problem of particle adhesion caused by laser cutting, and does not need to install an anti-crack structure to increase the screen ratio of the display panel. Enhance the performance of the display panel to block water and oxygen, improve the packaging effect of the packaging film layer, and prolong the service life of the display panel.

Description

technical field [0001] The invention relates to the display field, in particular to a display panel and a preparation method thereof. Background technique [0002] The basic structure of an Organic Light Emitting Diode (OLED) is a thin, transparent indium tin oxide (ITO) with semiconductor properties connected to an anode, plus another metal cathode to form a sandwich-like structure. The whole structural layer includes: hole transport layer (HTL), light emitting layer (EL) and electron transport layer (ETL). [0003] OLED has self-luminous characteristics, unlike TFE LCD which requires a backlight, so the visibility and brightness are very high, and the voltage requirement is low and the power saving efficiency is high, plus fast response, light weight, thin thickness, simple structure, and low cost And other characteristics, it is regarded as one of the most promising products in the 21st century. [0004] Since the organic material of the light-emitting layer is quite se...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L51/52H01L27/32
CPCH10K59/12H10K50/844H10K59/1201H10K71/00
Inventor 彭斯敏金江江
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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