Silicon wafer separation and loading machine for silicon wafer production

Abstract

The invention relates to a silicon wafer separation and loading machine for silicon wafer production. In a whole process of separation and conveying, a silicon wafer can be in contact with a foreign matter, so that the silicon wafer can be damaged, and the cost is increased. The machine has no monitoring function and cannot be connected with other equipment. The invention relates to the silicon wafer separation and loading machine for silicon wafer production, wherein the silicon wafer separation and loading machine comprises an elastic clamp conveying module, a separation mechanical arm, a separation mechanism, a conveying module, a shaping module, a silicon wafer inserting mechanical arm, an empty basket backflow module, a turnover module and a transplanting module which are all installed on a rack of the silicon wafer separation and loading machine, wherein the separation mechanism is arranged between the elastic clamp conveying module and the conveying module. According to the device, a silicon wafer separation and loading mechanism with a special structure is adopted to realize the process of separation and loading of the silicon wafers, and the silicon wafer separation and loading mechanism is highly automatic and is higher in speed, so that it is ensured that the silicon wafers can be separated quickly and accurately, the damage to the silicon wafers can be reduced, theintegrity of the silicon wafers can be guaranteed to the maximum degree, the benefits are increased, and the cost is lowered.

Description

technical field [0001] The invention relates to the technical field of silicon chip insertion machines, in particular to a chip loading machine used for silicon chip production. Background technique [0002] In the field of photovoltaics or semiconductors, the multi-wire cutting process is mostly used to turn silicon blocks into silicon wafers. Since this process uses steel wires to drive silicon carbide abrasives for cutting, there will be a lot of mortar attached to the silicon wafers after cutting. Washing can remove these mortars. Between cleaning, these silicon wafers need to undergo simple treatment, such as degumming, pre-cleaning to remove impurities such as strands and mortar on the surface of the silicon wafers, and finally insert the silicon wafers into the silicon wafer basket, and use acid and lye to clean the silicon wafers. Silicon wafers were cleaned ultrasonically. At present, most enterprises that produce silicon wafers are manually loaded, and the silico...

AI Technical Summary

Problems solved by technology

At present, most enterprises that produce silicon wafers are manually loaded, and the silicon wafers are inserted into the wafer basket one by one. Due to the residual mortar between the silicon wafers and the force of water, the silicon wafers will be very adsorbed. However, due to the uneven force of manual loading, it is easy to break the silicon wafer, and the loading efficiency is also poor.

The shortcomings of the existing film loading device are mainly manifested in: 1. Insufficient in automation, manual operation is required, automatic production and automatic transmission operations are not possible, and a series of subsequent operations such as loading and unloading baskets are difficult to automate to the extent that it is inconvenient for the user to use the device

Second, the processing speed is insufficient

During the whole process of separation and transportation, the silicon wafer will be in contact with foreign objects, which can also damage the silicon wafer and increase the cost

There is also a lack of monitoring functions, and it is not yet able to connect with other devices

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