A method of manufacturing an axial diode

Abstract

The invention discloses a manufacturing method of an axial diode, comprising the following steps: 1. Wafer cutting→2. Welding and assembling→3. High-temperature welding→4. Plastic sealing and forming→5. Lead-free electroplating→6. Electrical test braiding →7. Laser printing →8. Packaging. Due to the laser printing method for printing, the original 5H cooking work before lead-free electroplating is avoided. At the same time, consumables such as ink for ink printing and printing molds are no longer required to be purchased, which can reduce product costs and improve product appearance. Improve the product appearance quality level, improve the product appearance production pass rate by more than 1%, reduce product costs, and greatly improve the product appearance quality, thereby improving product quality.

Description

technical field

[0001] The invention relates to a manufacturing method of an axial diode, which belongs to the technical field of electronic components. Background technique

[0002] Diode, also known as crystal diode, referred to as diode (diode); it is an electronic device with unidirectional conduction current. There is a PN junction and two lead terminals inside the semiconductor diode. This electronic device has unidirectional current conductivity according to the direction of the applied voltage. Axial diode is a form of diode. It has a cylindrical body and round wires protruding from both ends. The diode chip is packaged inside the body. Its functions include rectification, voltage stabilization, voltage suppression, and light-emitting diodes.

[0003] There are existing axial diode manufacturing methods, usually using the following process methods:

[0004] Wafer cutting→welding assembly→high temperature welding→plastic sealing and molding→boiling for 5H→lead-free ...