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A method of manufacturing an axial diode

A diode and axial technology, which is applied in the field of electronic components, can solve problems such as customer appearance printing complaints, ink characters are easy to fall off, and increase product costs, so as to improve product appearance quality, improve product appearance quality, and reduce product costs. Effect

Active Publication Date: 2021-11-02
QIANGMAO ELECTRONICS WUXI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This production process uses ink printing to print on the material body, but because the material body is epoxy resin molding glue, which contains wax, it needs to be boiled for 5 hours before lead-free electroplating to remove the wax contained in the body in order to print the ink. The printing is printed on the material body, and the 5-hour cooking operation not only increases the production process, but also the material body is easy to be boiled and discolored or the wax is not boiled, which will cause the printed ink characters to fall off easily during subsequent ink printing, resulting in a low appearance pass rate and customer failure. Appearance and printing complaints and other issues; at the same time, consumables such as ink printing inks and printing models also need to be purchased regularly, which increases product costs

Method used

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Embodiment Construction

[0011] Specific embodiments of the present invention are described in detail below.

[0012] A method for manufacturing an axial diode, comprising the steps of:

[0013] The first step is to cut the wafer, place the wafer into the cutting machine, and cut it into a single chip by means of a diamond cutting knife;

[0014] The second step is welding and assembly. A wire loading machine is used to load the wires into the soldering boat. It is necessary to load the upper and lower soldering boats to connect the lead-out ends of the P and N terminals of the crystal grains. Use the solder pad shaker to fill the lower solder pads corresponding to the grain size into each hole of the soldering boat with the lower wires. The solder pads are placed on the wires and used to connect the N-terminal of the crystal grains to the wires. ; Place the die on the lower soldering piece through a fixture such as a die sucker, and then use a soldering plate shaker to fill the upper soldering piece...

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PUM

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Abstract

The invention discloses a manufacturing method of an axial diode, comprising the following steps: 1. Wafer cutting→2. Welding and assembling→3. High-temperature welding→4. Plastic sealing and forming→5. Lead-free electroplating→6. Electrical test braiding →7. Laser printing →8. Packaging. Due to the laser printing method for printing, the original 5H cooking work before lead-free electroplating is avoided. At the same time, consumables such as ink for ink printing and printing molds are no longer required to be purchased, which can reduce product costs and improve product appearance. Improve the product appearance quality level, improve the product appearance production pass rate by more than 1%, reduce product costs, and greatly improve the product appearance quality, thereby improving product quality.

Description

technical field [0001] The invention relates to a manufacturing method of an axial diode, which belongs to the technical field of electronic components. Background technique [0002] Diode, also known as crystal diode, referred to as diode (diode); it is an electronic device with unidirectional conduction current. There is a PN junction and two lead terminals inside the semiconductor diode. This electronic device has unidirectional current conductivity according to the direction of the applied voltage. Axial diode is a form of diode. It has a cylindrical body and round wires protruding from both ends. The diode chip is packaged inside the body. Its functions include rectification, voltage stabilization, voltage suppression, and light-emitting diodes. [0003] There are existing axial diode manufacturing methods, usually using the following process methods: [0004] Wafer cutting→welding assembly→high temperature welding→plastic sealing and molding→boiling for 5H→lead-free ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/50
CPCH01L21/67282H01L25/50
Inventor 方敏清
Owner QIANGMAO ELECTRONICS WUXI CO LTD
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