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Thick copper circuit board and manufacturing method thereof

A technology of thick copper circuit board and manufacturing method, which is applied in the field of circuit board manufacturing, can solve the problems of gas residue, thick copper layer of thick copper circuit board, etc., and achieve the effect of avoiding dryply defects

Active Publication Date: 2022-04-05
广东依顿电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The invention provides a thick copper circuit board, which solves the delamination problem caused by gas residue between the lines when the thick copper layer is thicker when the board is pressed.

Method used

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  • Thick copper circuit board and manufacturing method thereof
  • Thick copper circuit board and manufacturing method thereof
  • Thick copper circuit board and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0061] Example 1: See attached figure 1 to attach image 3 , the present embodiment provides a thick copper circuit board, including a multilayer graphic circuit layer 1 and a multilayer insulating dielectric layer 2, as attached figure 1 As shown, the insulating dielectric layer 2 is arranged between the two adjacent graphic circuit layers 1, and the insulating dielectric layer 2 is a prepreg, so as to isolate the two circuit layers and avoid the short circuit of the graphic circuit layer; The graphic circuit layer 1 is provided with at least one graphic circuit unit 11 , of course, a plurality of graphic circuit units may be provided as required, specifically designed according to the shape and size of the required graphic circuit unit. The edge of the graphic circuit layer is surrounded by a process edge 12, which is used to ensure the efficiency and quality of the thick copper circuit board in the subsequent assembly process, and can also disperse the heat received by the...

Embodiment 2

[0066] Example 2: See attached Figure 4 to attach Figure 5 , the present embodiment provides a method for manufacturing a thick copper circuit board, comprising the following steps:

[0067] S1. Material cutting: Cut the qualified thick copper clad laminate into a predetermined size and shape, and then clean and dry the surface. The thick copper clad laminate is made of cured resin film and 3OZ, 4OZ, 5OZ, 6OZ copper foil and other copper foils of the same or different thickness;

[0068] S2. Transfer of inner layer graphic circuit: a layer of photosensitive material is pasted on the copper clad core board, and then the negative graphic black film is used for counter-position exposure, so that the photosensitive material in the circuit area is cured during the exposure process, and the image is completed transfer. The black film is provided with graphic light blocking points, the shape and size of the graphic light blocking points are consistent with the shape and size of ...

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Abstract

The invention discloses a thick copper circuit board and a manufacturing method thereof. The thick copper circuit board of the invention comprises a multi-layer graphic circuit layer and a multi-layer insulating medium layer, and the insulating medium layer is arranged on two adjacent layers of the graphic circuit layer. Between, the insulating medium layer is a prepreg, at least one graphic circuit unit is arranged in the graphic circuit layer, the edge of the graphic circuit layer is surrounded by a process edge, and an air guide groove is opened on the process edge, so The air guide groove runs through the inner and outer sides of the process side. The air guide groove provided on the process edge of the graphic circuit layer edge of the thick copper circuit board of the present invention facilitates the copper-free area of ​​the inner graphic circuit layer on the thick copper circuit board to be able to pump air through the air guide groove when pressing Become a vacuum state to ensure that the resin on the prepreg fully fills the copper-free area and avoids dry ply defects.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a thick copper circuit board and a manufacturing method thereof. Background technique [0002] With the rapid development of electronics and power communication technology, some high-current and high-power power supply products are more and more widely used, and the number of functional components integrated on the circuit board is increasing. The requirements are getting higher and higher, and the copper thickness of the circuit board will become thicker and thicker. The circuit board industry usually refers to the circuit board with a bottom copper thickness of 105 μm (3OZ) and above as a thick copper circuit board. Thick copper circuit board has the characteristics of strong conduction capacity, high reliability and high heat dissipation performance. It is suitable for the current rapid development of new energy electric vehicles and electric vehicle indust...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00H05K3/06H05K3/46H05K3/42
CPCH05K1/0298H05K1/0269H05K3/0052H05K3/06H05K3/4611H05K3/42H05K3/423
Inventor 莫介云
Owner 广东依顿电子科技股份有限公司
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