Thermal barrier/high-temperature low infrared emissivity integrated coating, metal composite material with coating and preparation method thereof

A metal composite material, low infrared emission technology, applied in coating, metal material coating process, melt spraying and other directions, can solve the problem of high thermal barrier coating emissivity, achieve high thermal expansion coefficient, improve temperature resistance and High temperature thermal shock performance, effect of delaying coating failure

Active Publication Date: 2019-08-13
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous improvement of the thrust-to-weight ratio of aero-engines, coating TBCs on the surface of metal alloy substrates is one of the main means to quickly and effectively improve

Method used

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  • Thermal barrier/high-temperature low infrared emissivity integrated coating, metal composite material with coating and preparation method thereof
  • Thermal barrier/high-temperature low infrared emissivity integrated coating, metal composite material with coating and preparation method thereof
  • Thermal barrier/high-temperature low infrared emissivity integrated coating, metal composite material with coating and preparation method thereof

Examples

Experimental program
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Example Embodiment

[0052] Example 1:

[0053] like figure 1 As shown in the figure, a thermal barrier / high temperature and low infrared emissivity integrated coating, the coating is a multi-layer superposed structure, which sequentially includes CoNiCrAlY metal bonding layer, SmMgAl from inside to outside 11 O 19 Thermal barrier ceramic layer and low infrared emissivity layer. Among them, the low infrared emissivity layer is composed of Bi 2 O 3 -Sm 2 O 3 -MgO-Al 2 O 3 -Li 2 O-SiO 2 The glass is the binding phase and the Pd powder is the conductive phase, and the Pd powder accounts for 82% of the total mass of the low infrared emissivity layer.

[0054] The thickness of the above-mentioned CoNiCrAlY metal bonding layer is 0.08mm, SmMgAl 11 O 19 The thickness of the thermal barrier ceramic layer is 0.35mm, the thickness of the low infrared emissivity layer is 0.025mm, and the total thickness of the coating is 0.455mm.

[0055] The coated metal composite material in this embodiment in...

Example Embodiment

[0068] Example 2:

[0069] A thermal barrier / high temperature and low infrared emissivity integrated coating, the thermal barrier / high temperature and low infrared emissivity integrated coating is a multi-layer superimposed structure, and sequentially includes CoNiCrAlY metal bonding layer, SmMgAl from inside to outside 11 O 19 Thermal barrier ceramic layer and low infrared emissivity layer. Among them, the low infrared emissivity layer is composed of Bi 2 O 3 -Sm 2 O 3 -MgO-Al 2 O 3 -Li 2 O-SiO 2 The glass is the binding phase and the Pd powder is the conductive phase, and the Pd powder accounts for 82% of the total mass of the low infrared emissivity layer.

[0070] The thickness of the above-mentioned CoNiCrAlY metal bonding layer is 0.05mm, SmMgAl 11 O 19 The thickness of the thermal barrier ceramic layer is 0.08mm, the thickness of the low infrared emissivity layer is 0.02mm, and the total thickness of the coating is 0.15mm.

[0071] The coated metal composite...

Example Embodiment

[0084] Example 3:

[0085] A thermal barrier / high temperature and low infrared emissivity integrated coating, the thermal barrier / high temperature and low infrared emissivity integrated coating is a multi-layer superimposed structure, which sequentially includes CoNiCrAlY metal bonding layer, NdMgAl from inside to outside 11 O 19 Thermal barrier ceramic layer and low infrared emissivity layer. Among them, the low infrared emissivity layer is composed of Bi 2 O 3 -Nd 2 O 3 -MgO-Al 2 O 3 -Li 2 O-SiO 2 The glass is the binding phase, and the Pd powder is the conductive phase, and the Pd powder accounts for 80% of the total mass of the low infrared emissivity layer.

[0086] The thickness of the above-mentioned CoNiCrAlY metal bonding layer is 0.08mm, and the thickness of NdMgAl 11 O 19 The thickness of the thermal barrier ceramic layer is 0.25mm, the thickness of the low infrared emissivity layer is 0.02mm, and the total thickness of the coating is 0.35mm.

[0087] Th...

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Abstract

The invention discloses a thermal barrier/high-temperature low infrared emissivity integrated coating. The coating is of a multilayer stacked structure. The multilayer stacked structure successively comprises a metal bonding layer, a thermal barrier ceramic layer and a low infrared emissivity layer from inside to outside. The thermal barrier ceramic layer is a rare earth hexaaluminate layer, and the low infrared emissivity layer is a Bi2O3-MgO-Al2O3-Li2O-SiO2 serial glass coating containing a conductive phase Pd powder. The integrated coating has the advantages of heat-insulating property, high-temperature low infrared emissivity, high bonding strength and the like. The metal composite material with the coating is simple and manure in process, relatively low in cost and easy for scaled production and application.

Description

technical field [0001] The invention belongs to the field of functional coatings and composite materials thereof, in particular to a composite coating, a coated metal composite material and a preparation method thereof. Background technique [0002] To reduce the surface temperature and emissivity of the target by cooling, cooling, shading or reducing the emissivity, so as to change the infrared radiation characteristics of the target, are two important technical ways to achieve infrared stealth. Among them, the low infrared emissivity coating is to use the surface coating technology to coat the coating material with low infrared emissivity characteristics on the high temperature part of the aircraft to reduce its surface emissivity. It has become a simple and effective way to improve the infrared stealth performance of aircraft. Convenient and effective technical means. Currently commonly used low-infrared emissivity materials mainly include noble metal coatings and inorga...

Claims

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Application Information

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IPC IPC(8): C23C4/134C23C4/11C23C4/02C23C4/073
CPCC23C4/02C23C4/073C23C4/11C23C4/134
Inventor 黄文质刘海韬甘霞云黄丽华
Owner NAT UNIV OF DEFENSE TECH
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