High precision diamond grinding wheel processing method and special processing equipment matched with same

A technology of diamond grinding wheel and processing method, which is applied in the direction of metal processing equipment, grinding/polishing equipment, manufacturing tools, etc., and can solve problems restricting the development of IC chip technology, etc.

Inactive Publication Date: 2019-08-16
群基精密工业(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, domestic enterprises do not have the ability to produce and manufacture such high-precision diamond grinding wheels, which are all imported from abroad, which has become a bottleneck restricting the development of IC chip technology.

Method used

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  • High precision diamond grinding wheel processing method and special processing equipment matched with same
  • High precision diamond grinding wheel processing method and special processing equipment matched with same

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Embodiment Construction

[0022] In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms "front", "rear", "upper" and "lower" are based on the orientations or positional relationships shown in the drawings, and are only for It is convenient to describe the present invention and simplify the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and thus should not be construed as limiting the present invention.

[0023] The content of the present invention will be further described in detail below in conjunction with specific embodiments. The invention relates to a high-precision diamond grinding wheel processing method. The diamond grinding wheel is always kept in a vertical state and rotates around its central axis. The processing electrode plate is arranged directly above the diamond grinding wheel, a...

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Abstract

The invention relates to a high precision diamond grinding wheel processing method. A diamond grinding wheel is always kept in a vertical state and rotates around the central axis of the diamond grinding wheel. A processing electrode plate is arranged over the diamond grinding wheel and is provided with a plurality of electric erosion protrusions arranged in parallel, and an annular groove is formed in the periphery of the diamond grinding wheel in an electric erosion processing manner. In the actual forming process, the annular groove is subjected to electric erosion forming at several timesin the depth direction of the annular groove, and after electric erosion is completed each time, the processing electrode plate stays for a period of time until no spark is generated. In this way, inthe actual processing process of the diamond grinding wheel, the electric erosion protrusions arranged on the processing electrode plate are used for layered processing of the periphery of the diamondgrinding wheel, the annular groove is finally formed, the forming quality of the annular groove is ensured, and it is ensured that circumferential runout of the diamond grinding wheel is controlled within reasonable values.

Description

technical field [0001] The invention relates to the technical field of high-precision grinding wheel manufacturing, in particular to a high-precision diamond grinding wheel processing method and special processing equipment adapted thereto. Background technique [0002] With the rapid development of IC chip technology, the semiconductor industry has higher and higher requirements for the flatness, surface quality and integrity of silicon wafers. Semiconductor silicon wafer is the main substrate material of modern ultra-large-scale integrated circuits. It is generally manufactured through processes such as crystal pulling, slicing, chamfering, grinding, grinding, corrosion, polishing, and cleaning. Because high-precision diamond grinding wheels have unique advantages in flatness, material removal rate, low cost, etc., they are widely used in ultra-precision chamfering and grinding processes of silicon wafers. As far as the current silicon wafer processing technology requirem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00
CPCB24D18/009
Inventor 孙德吉
Owner 群基精密工业(苏州)有限公司
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