A preparation method of microsphere probe based on microcantilever transfer

A micro-cantilever and probe technology, which is applied to the photoengraving process, welding equipment, manufacturing tools, etc. of the pattern surface, can solve the problems of easy fork of the needle tip, high price, single probe material, etc., and increase the loading range. , The effect of reducing the loading error and increasing the contact area

Active Publication Date: 2022-01-28
SOUTHWEST JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] The preparation method of probes has attracted much attention as a prerequisite for the application of probe technology, but the preparation of large-size (hundred micron) microsphere probes has not been extensively studied.
Large-size (hundred-micron-scale) microsphere probes can be used for mesoscopic micro-nano processing. At present, the probe materials used in this scale processing are relatively single, mostly diamond materials, and the preparation is difficult and expensive; and Due to the high brittleness of diamond, the needle tip is easily bifurcated during processing, which seriously restricts micro-nano processing at the mesoscopic scale.

Method used

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  • A preparation method of microsphere probe based on microcantilever transfer
  • A preparation method of microsphere probe based on microcantilever transfer
  • A preparation method of microsphere probe based on microcantilever transfer

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Embodiment Construction

[0025] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0026] see figure 1 , a method for preparing microsphere probes based on microcantilever transfer, realized by the following steps:

[0027] S1. Place the microspheres and the adhesive on the first preset area and the second preset area of ​​the silicon wafer respectively, and place the silicon wafer on the sample stage.

[0028] In this embodiment, microspheres of appropriate material and size are selected according to requirements, placed on a predetermined microsphere placement area on the silicon wafer, and the adhesive is placed on another predetermined area on the silicon wafer.

[0029] In this embodiment, the material of the microspheres is not particularly limited, and the size can be changed in a large gradient range from nanometers to millimeters, and the best effect is especially when the radius of curvature is in the range of 50-500 μm. Pr...

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Abstract

The invention provides a microsphere probe preparation method based on microcantilever transfer, which belongs to the technical field of micro-nano manufacturing. The invention has simple process and low cost, and can be used for the preparation of microsphere probes for micro-nano processing or indentation mechanical properties testing; the invention can realize flexible bonding of any granular material, and can be matched with any receptor platform arbitrarily; The cantilever can act as a transfer layer while transferring the microspheres, increasing the contact area between the microspheres and the receptor platform, thereby reducing the contact pressure to reduce the deformation of the receptor platform; Accurate positioning of the tip of the body, and can avoid the small size of the microspheres completely immersed in the glue during bonding, polluting the surface of the microsphere probe.

Description

technical field [0001] The invention belongs to the technical field of micro-nano manufacturing, and in particular relates to a method for preparing microsphere probes based on microcantilever transfer. Background technique [0002] With the wide application of micro-nano-sized components in various fields such as MEMS, IC, and optical devices, micro-nano processing methods and technologies are also facing great challenges while making great progress. Carrying out research on micro-nano-scale processing methods is of great significance not only for the development of advanced manufacturing technology, but also for my country to maintain a favorable position in the new round of scientific and technological competition. In recent years, due to the advantages of high flexibility and high precision, probe technology has gradually been widely used in the field of micro-nano processing. Probe technology is to achieve material removal, oxide layer growth, texture processing and ot...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C3/00
CPCB81C3/001
Inventor 陈磊石鹏飞钱林茂郭杰陈超肖晨晏文孟
Owner SOUTHWEST JIAOTONG UNIV
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