A method for cleaning black edge of silicon nitride ceramic copper clad laminate
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A technology of silicon nitride ceramics and copper-clad laminates, applied in the field of copper-clad laminates, can solve problems such as chemical methods that are difficult to remove, and achieve the effects of simple and convenient cleaning operations, favorable promotion and use, and low cleaning costs
Active Publication Date: 2021-01-15
WUXI TIANYANG ELECTRONICS
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[0003] Silicon nitride is regarded as the first choice for automotive electronics-grade IGBT heat dissipation substrates due to its good thermal conductivity and high reliability. However, during the laser cutting process of silicon nitride copper clad laminates, black films (mainly Silicon and silicon oxynitride), the film layer is relatively thin, but its chemical properties are relatively stable, and it is difficult to remove it by ordinary chemical methods
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Embodiment 1
[0020] Embodiment 1. The present invention provides a technical solution: a method for cleaning the black edge of a silicon nitride ceramic copper-clad laminate, comprising the following steps;
[0021] Step 1: Put the cut silicon nitride ceramic copper-clad laminate into 45°C pure water for 2 minutes and ultrasonically wash it to remove the remaining cutting dust on the surface;
[0022] After the silicon nitride ceramic copper clad laminate is cut, it needs to be edged;
[0023] S1. Use a grinder to grind the corners of the cut silicon nitride ceramic copper clad laminates. During the grinding process, the silicon nitride ceramic copper clad laminates must not be deformed to make the corners round and smooth;
[0024] S2, then sand with 800# fine emery cloth, so that the corners of the silicon nitride ceramic copper clad laminate are smooth and natural, the front is flat, and there are no burrs until the Ra value is 10 μm;
[0025] Step 2. Put the cleaned silicon nitride ce...
Embodiment 2
[0031] Embodiment 2. The present invention provides a technical solution: a method for cleaning the black edge of a silicon nitride ceramic copper-clad laminate, comprising the following steps;
[0032] Step 1: Put the cut silicon nitride ceramic copper-clad laminate into pure water at 25°C for ultrasonic washing for 2 minutes to remove the residual cutting dust on the surface;
[0033] After the silicon nitride ceramic copper clad laminate is cut, it needs to be edged;
[0034] S1. Use a grinder to grind the corners of the cut silicon nitride ceramic copper clad laminates. During the grinding process, the silicon nitride ceramic copper clad laminates must not be deformed to make the corners round and smooth;
[0035] S2, then sand with 700# fine emery cloth, so that the corners of the silicon nitride ceramic copper clad laminate are smooth and natural, the front is flat, and there are no burrs until the Ra value is 12 μm;
[0036] Step 2. Put the cleaned silicon nitride cera...
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Abstract
The invention discloses a method for cleaning the black edge of a silicon nitride ceramic copper clad laminate. The method comprises the following steps of 1, putting the cut silicon nitride ceramic copper clad laminate into pure water with the temperature of 10 DEG C-50 DEG C for ultrasonic washing for 1 min-2 min; 2, putting the cleaned silicon nitride ceramic copper clad laminate into a solution containing a certain copper corrosion inhibitor; 3, slowly and uniformly dropping hydrogen peroxide with the concentration of 10%-40% into the solution containing the copper corrosion inhibitor, andthen taking out the silicon nitride ceramic copper clad laminate; 4, washing the silicon nitride ceramic copper clad laminate with the pure water, and then putting the silicon nitride ceramic copperclad laminate into dilute hydrochloric acid solution with the concentration of 5%-10% for removing a slight oxidation layer on the surface, and finally washing the silicon nitride ceramic copper cladlaminate with the pure water again; and 5, putting the silicon nitride ceramic copper clad laminate with the black edge pre-oxidized into a hydrofluoric acid solution, and carrying out ultrasonic soaking for 30 min-40 min, thus thoroughly removing the black edge. According to the method, through the pre-oxidation and re-cleaning methods, a corresponding black film can be washed away without damaging copper on the surface of silicon nitride, thus thoroughly removing the black edge.
Description
technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a method for cleaning black edges of silicon nitride ceramic copper-clad laminates. Background technique [0002] Ceramic-based copper clad laminate has high thermal conductivity, high heat resistance, chemical corrosion resistance, high voltage current resistance, high dimensional stability, low signal loss and other properties, and is an ideal carrier for special electrical circuits; [0003] Silicon nitride is regarded as the first choice for automotive electronics grade IGBT heat dissipation substrates due to its good thermal conductivity and high reliability. However, during the laser cutting process of silicon nitride copper clad laminates, black films (mainly Silicon and silicon oxynitride), the film is relatively thin, but its chemical properties are relatively stable, and it is difficult to remove it by ordinary chemical methods. Contents of the invention...
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