Deep silicon etching method for MEMS

Abstract

The invention provides a deep silicon etching method for an MEMS, and belongs to the technical field of deep silicon etching. According to the technical scheme, the deep silicon etching method of theMEMS comprises a deposition step, a cleaning step, an etching step, a purging step, a repeated deposition step, a repeated cleaning step, a repeated etching step and a repeated purging step, and is characterized in that side circulation is carried out through the deposition step, the cleaning step, the etching step and the purging step for multiple times, and a sample is vacuumized. The beneficialeffects of the deep silicon etching method are as follows: the deep silicon etching method disclosed by the invention can be applied to a large-scale integrated circuit industrial manufacturing environment; particularly, the integrity of sensing elements can be kept during long-time etching, the device design requirement can be met, the purging step is added, the temperature of the vacuum reaction chamber and the temperature of the sample table can be reduced, the vacuum reaction chamber is kept within a constant range, and the uniformity of large-size samples after being etched and the roughness of the side wall of the MEMS device can be easily provided.

Description

technical field [0001] The invention relates to the technical field of deep silicon etching, in particular to a MEMS deep silicon etching method. Background technique [0002] Micro-electromechanical systems (MEMS) is the integration of information sensing, processing, mechanical execution and other micro-devices in a micro-system in a high-density, low-cost manner according to the manufacturing principles of integrated circuits. The interdisciplinary phenomenon in MEMS is extremely obvious, mainly involving micromachining technology, mechanics, solid acoustic theory, heat flow theory, electronics, biology, etc. The characteristic length is from 1um to 1mm. [0003] The processing technology for MEMS devices is not mechanical. Instead, they employ microfabrication techniques similar to batch processing of integrated circuits. Mass manufacturing can significantly reduce the cost of mass production. If the area of ​​a single MEMS sensor chip is 5mm*5mm, then an 8-inch (20 c...

AI Technical Summary

Problems solved by technology

In the deep silicon etching system, if there are too many cycles in multiple steps, the temperature of the chamber and the sample stage will be too high, which will lead to uneven etching and excessive roughness of the side wall of the MEMS device.

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