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High thermal conduction polyether ether ketone resin and molding product thereof

A technology for polyetheretherketone resin and polyetheretherketone, which is applied in the field of high thermal conductivity polyetheretherketone resin and its molded products, can solve the problems of difficulty in producing polyetheretherketone resin and the reduction of mechanical properties such as impact strength. , to achieve the effect of balancing tensile strength and impact strength, improving thermal conductivity, and improving service life

Inactive Publication Date: 2019-09-03
JIANGSU AOSHENG COMPOSITE MATERIALS HI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Chinese Invention Patent Application Publication No. CN106243620B discloses a polyether ether ketone thermally conductive composite material and its preparation method and application. Fillers with different thermal conductivity are added to polyetheretherketone to prepare the composite material. Although the thermal conductivity is significantly improved, the Its mechanical properties such as impact strength are significantly reduced due to the addition of small molecule fillers, which limits its application to a certain extent.
[0004] In summary, in the prior art, it is difficult to produce a polyether ether ketone resin with excellent mechanical properties and high thermal conductivity, so a high thermal conductivity polyether ether ketone resin is proposed

Method used

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  • High thermal conduction polyether ether ketone resin and molding product thereof
  • High thermal conduction polyether ether ketone resin and molding product thereof
  • High thermal conduction polyether ether ketone resin and molding product thereof

Examples

Experimental program
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Effect test

Embodiment 1～15

[0072] The high thermal conductivity polyether ether ketone material was prepared by the following method: blend polyphenylene sulfide, sulfate and 60% carbon fiber at 350°C according to the ingredients and proportions shown in Table 1, and keep the shear rate at 150~ 250s -1 , to obtain the first blend; then at 400°C, the first blend, polyetheretherketone and the remaining 40% of carbon fibers were blended according to the ingredients and proportions shown in Table 1, and the shear rate was kept at 80~140s -1 , to prepare polyether ether ketone material with high thermal conductivity. Then it was molded at 350°C into samples required for tensile and impact tests, and various performance tests were performed. The results are listed in Table 2.

Embodiment 16

[0074] Blend polyether ether ketone, polyphenylene sulfide, carbon fiber, magnesium sulfate and barium sulfate at 400°C according to the ingredients and proportions in Example 1, and keep the shear rate at 150-250s -1 . Then it was molded at 350°C into samples required for tensile and impact tests, and various performance tests were performed. The results are listed in Table 2.

Embodiment 17

[0076] Blend polyetheretherketone and 40% carbon fiber at 400°C according to the ingredients and proportions in Example 1, and keep the shear rate at 150-250s -1 , to obtain the first blend; then at 350 ° C, the first blend, polyphenylene sulfide and the remaining 60% carbon fiber were blended according to the ingredients and proportions of Example 1, and the shear rate was maintained at 80 ~140s -1 , High thermal conductivity polyether ether ketone material. Then it was molded at 350°C into samples required for tensile and impact tests, and various performance tests were performed. The results are listed in Table 2.

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Abstract

The invention relates to the technical field of thermal conduction resins, particularly to a high thermal conduction polyether ether ketone resin, which comprises the following raw materials by weight: 100 parts of polyether ether ketone, 40-70 parts of polyphenylene sulfide, 25-35 parts of carbon fiber, and 5-20 parts of sulfate, wherein the viscosity of the polyether ether ketone is not more than 100 Pa.s at a temperature of 400 DEG C under 1000 / s. According to the present invention, the prepared high thermal conduction polyether ether ketone resin has characteristics of significantly increased thermal conductivity coefficient, relatively balanced tensile strength and impact strength, can be used for producing thermal conduction circuit boards, heat exchange materials, thermal conductioninsulating plates, wear-resistant bearings, petrochemicals and other materials related to thermal conduction, and can meet the requirements under harsh conditions in the engineering field; and the material and the molded product made of the material have high thermal conductivity, and can export the surrounding heat during the use so as to reduce the environment and equipment temperatures and prolong the service life of the equipment.

Description

technical field [0001] The invention relates to the technical field of heat-conducting resins, in particular to a high-heat-conducting polyetheretherketone resin and molded products thereof. Background technique [0002] In recent years, traditional thermal conductivity materials have been difficult to meet people's needs in use. With the rapid development of special engineering materials, research on high thermal conductivity engineering materials has attracted much attention. Polyether ether ketone (PEEK) resin is the most typical material in polyarylether ketone (PAEK). It is a kind of thermoplastic engineering plastic with excellent comprehensive performance in recent years, high temperature resistance, chemical resistance and excellent rigidity and toughness. It has been gradually applied In aerospace, automotive, energy and other fields. However, single-component polyether ether ketone has poor performance in terms of thermal performance and antistatic performance, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/16C08L81/02C08K7/06C08K3/30C09K5/14
CPCC08K2003/3045C08K2003/3063C08K2201/011C08L61/16C09K5/14C08L81/02C08K7/06C08K3/30
Inventor 严兵赵清新郎鸣华刘成何定军于洋张林强
Owner JIANGSU AOSHENG COMPOSITE MATERIALS HI TECH
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