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Printed circuit board and test fixture

A technology for printed circuit boards and backplanes, used in printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve the problems of discontinuous impedance, increased test times, and low test efficiency.

Active Publication Date: 2019-09-06
SICHUAN JIUZHOU ELECTRIC GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the PIN of the SMA connector is in contact with the crimping of the printed board pad, there is poor contact or partial contact, resulting in discontinuous impedance of the PIN of the SMA and the contact part of the PCB, which leads to low test efficiency and increased test times.

Method used

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  • Printed circuit board and test fixture
  • Printed circuit board and test fixture
  • Printed circuit board and test fixture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The embodiment of the present application provides a printed circuit board, which will be described below.

[0020] figure 2 It shows a top plan structural schematic view of the contact pad of the printed circuit board in the embodiment of the present application.

[0021] Example of this application figure 2 A single connection point is taken as an example. As shown in the figure, the printed circuit board includes: a base plate and one or more connection points, the base plate includes multiple layers, and the one or more connection points are located at the The outermost layer of the bottom plate, each connection point includes a contact pad and a conversion signal hole; the contact pad is connected to the conversion signal hole through a parallel microstrip line; the conversion signal hole is used to connect the other layers of the bottom plate.

[0022] During specific implementation, the printed circuit board in the embodiment of the present application may i...

Embodiment 2

[0061] Based on the same inventive concept, an embodiment of the present application provides a test fixture.

[0062] Figure 4 A schematic structural diagram of the test fixture in the embodiment of the present application is shown.

[0063] As shown in the figure, the test fixture includes: the printed circuit board as described in Embodiment 1, and an SMA connector, the PIN of the SMA connector is bonded to the contact pad, and the SMA connector The other end is connected with a transmission line, and the transmission line is used for connecting the device under test.

[0064] During specific implementation, the device under test may be a device component such as a connector under test, an oscilloscope, and the like.

[0065] The SMA connector is solder-free, and can be directly fixed and assembled with the printed circuit board by screws. The contact pad is located at the center of the SMA connector to ensure precise alignment between the contact pad and the PIN of the...

Embodiment 3

[0078] The following embodiment of the present application will be described with a specific example.

[0079] The bottom plate of the PCB is provided with 3 connection points A, B, C, and each connection point includes an SMA contact pad and a conversion signal hole; the SMA contact pad is connected to the conversion via a parallel microstrip line. The signal hole is connected; the conversion signal hole is used to connect different layers of the bottom board.

[0080] The radius of the SMA contact pad is 0.2mm-0.4mm, the size of the conversion signal hole is 0.5mm, and the distance from the conversion signal hole to the center of the SMA contact pad is 0.5mm-2mm, The impedance of the conversion signal hole is 50 ohms. The line width of the parallel microstrip line can be calculated according to the impedance, and the impedance of the parallel microstrip line is 50 ohms.

[0081] A GND shielding ring is arranged around the outside of the SMA contact pad and the conversion s...

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Abstract

The invention discloses a printed circuit board and a test fixture. The printed circuit board comprises a bottom board and one or more connecting points; the bottom board comprises a plurality of layers; the one or more connecting points are positioned on the outermost layer of the bottom board; each connecting point comprises a contact type bonding pad and a conversion signal hole; the contact type bonding pads are connected with the conversion signal holes through parallel microstrip lines; and the conversion signal holes are used for being connected with other layers of the bottom board. Bythe adoption of the scheme, when SMA connector PINs are in crimp contact with the bonding pads of the printed board, full contact is ensured to be formed, so that the problems of poor contact and thelike are avoided, and the impedance of the part is ensured to be continuous as much as possible.

Description

technical field [0001] The present application relates to circuit board technology, in particular, to a printed circuit board and a test fixture. Background technique [0002] With the rapid development of computer simulation technology, the integration of high-speed products is getting higher and higher, and the corresponding rise time is getting shorter and shorter. Small changes in the structure and medium during the transmission process will have a great impact on signal transmission. During the design verification process, usually in order to connect the test pins to the ports of the network analyzer, a special test fixture needs to be designed. In order to reduce the impact of the test board on the test piece, the difficulty of the test fixture lies in the time delay and impedance control of the test point, SMA (Sub Miniature versionA) connector and test equipment. [0003] The most critical part of SMA connector and PCB (Printed Circuit Board, Printed Circuit Board) ...

Claims

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Application Information

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IPC IPC(8): H05K1/02G01R1/04
CPCG01R1/0408G01R1/0416H05K1/0268H05K2203/162
Inventor 许志辉冯立
Owner SICHUAN JIUZHOU ELECTRIC GROUP
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