Chemical gold plating solution applied to PCB chemical gold-palladium plating

A technology of chemical gold plating and chemical gold, which is applied in the field of chemical gold plating solution, can solve the problems of high-frequency signal loss, poor chemical resistance, and delay in the nickel-palladium-gold process, and achieve high-frequency signal loss and delay, good stability, and improved efficiency effect

Active Publication Date: 2019-09-17
深圳市溢诚电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the above-mentioned technologies, the present invention discloses an electroless gold plating solution applied to chemical gold-palladium-gold plating on PCBs. The gold-plating solution can perfectly match the two gold s

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] Potassium aurous cyanide (as Au + Calculated): 0.6g / L, acetohydroxamic acid: 10g / L, phenylhydroxamic acid: 10g / L, 2,2'-dipyridylamine: 20mg / L, lanthanum sulfate (in La 2+ Calculated): 0.1ppm, thallium sulfate (in TI 2+ Total): 0.1ppm, 2-morpholineethanesulfonic acid: 6g / L

[0063] pH=6.8, T=86°C

[0064] The gold plating solution composed of the above components can satisfy the use of two gold tanks before and after the palladium tank at the same time. Gold thickness up to 3.0μinch. The appearance of the obtained gold layer is flat and bright, there is no permeation plating on the circuit, the stability of the bath solution reaches 10MTO, and the bonding force of the coating layer is good as tested by the tape method. The gold-plating solution is sealed and placed at room temperature for 6-12 months without decomposition, and the stability is excellent, which can meet normal use. At the same time, after the bending resistance test of the coating, no obvious cracks ...

Embodiment 2

[0066] Potassium aurous cyanide (as Au + Total): 0.8g / L, acetylhydroxamic acid: 15g / L, benzohydroxamic acid: 2g / L, 2,4-dimethylpiperidine: 50mg / L, lanthanum sulfate (in La 2+ Calculated): 0.2ppm thallium sulfate (in TI 2+ Total): 0.5ppm, Bis(2-hydroxyethylamino)tri(hydroxymethyl)methane: 10g / L

[0067] pH=6.4, T=90°C

[0068] The gold plating solution composed of the above components can satisfy the use of two gold tanks before and after the palladium tank at the same time. Gold thickness up to 3.0μinch. The appearance of the obtained gold layer is smooth and bright, there is no seepage plating on the circuit, the stability of the bath solution reaches 12MTO, and the adhesive force of the coating layer is good as tested by the tape method. The gold-plating solution is sealed and placed at room temperature for 6-12 months without decomposition, and the stability is excellent, which can meet normal use. At the same time, after the bending resistance test of the coating, no ...

Embodiment 3

[0070] Potassium aurous cyanide (as Au + Total): 0.8g / L, acetylhydroxamic acid: 7g / L, benzohydroxamic acid: 1g / L, salicylic hydroxamic acid: 5g / L, 2,4-lutidine: 5mg / L, thallium sulfate (in TI 2+ Total): 2ppm, piperazine-1,4-diethanesulfonic acid: 5g / L

[0071] pH=6.2, T=87°C

[0072] The gold plating solution composed of the above components can satisfy the use of two gold tanks before and after the palladium tank at the same time. Gold thickness up to 3.0μinch. The appearance of the obtained gold layer is flat and bright, there is no permeation plating on the circuit, the stability of the bath solution reaches 10MTO, and the bonding force of the coating layer is good as tested by the tape method. The gold-plating solution is sealed and placed at room temperature for 6-12 months without decomposition, and the stability is excellent, which can meet normal use. At the same time, after the bending resistance test of the coating, no obvious cracks were observed at 100 times m...

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Abstract

The invention discloses a chemical gold plating solution applied to PCB chemical gold-palladium plating. The chemical gold plating solution comprises the following components of, by mass concentration, main salt containing 0.6-1g/L of gold, 1-35g/L of coordination agent, 1-150mg/L of stabilizer, 0.1-10ppm of accelerator and 1-25g/L of pH buffering agent and balance pure water. The method comprises the following steps of adding 50% of water, adding the coordination agent, the stabilizer and the accelerator at one time in the continuous stirring process, adjusting pH value to be within the range of 6.2-6.8, then adding the pH buffering agent, and finally adding gold salt to keep constant volume and form the chemical gold plating solution. According to the gold plating solution, the requirements of a front gold tank and a rear gold tank using the same system of gold plating solution in the gold-palladium process can be met; the gold deposition rate of the gold plating formula is moderate, the gold plating solution is good in stability and can be generally up to more than 10 MTO; and a gold coating with a flat, bright and dense surface and without color difference can be obtained.

Description

technical field [0001] The invention relates to the technical field of PCBs, in particular to an electroless gold plating solution applied to chemical gold-palladium-gold plating on PCBs. Background technique [0002] AAU (Active Antenna System) is a new form of wireless base station that integrates RF TRX channels and antenna transmitting units. With the development of 5G technology, the requirements for the integration of antennas are significantly higher. AAU needs to integrate more components in a smaller size and adopt more layers of PCB technology. Therefore, the PCB consumption of a single base station will increase significantly. Its process And raw materials need to be fully upgraded, and technical barriers have been fully improved. The transmission power of 5G base stations is greatly expanded compared with 4G, which requires a comprehensive upgrade of PCB substrates, which must meet the characteristics of high frequency, high speed, and good heat dissipation, suc...

Claims

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Application Information

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IPC IPC(8): C23C18/42
CPCC23C18/42
Inventor 许国军卢意鹏吴运会许香林刘高飞
Owner 深圳市溢诚电子科技有限公司
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