A kind of transfer substrate, transfer method and transfer equipment of light-emitting diode

Abstract

The invention discloses a transfer substrate, a transfer method of a light-emitting diode, and a transfer device. The transfer substrate includes: a base, a reflective layer located on one side of the base, an optical conversion layer located on the side of the reflective layer away from the base, and a base located on the optical conversion layer. A light-sensitive anti-adhesion film on the side facing away from the reflective layer; an optical conversion layer for converting a certain wavelength range of light into non-visible light; a light-sensitive anti-adhesion film for bonding LEDs and reducing the viscosity to release the LEDs after exposure to non-visible light . Using the above-mentioned transfer substrate can complete the transfer and detection of the light-emitting diodes at the same time, and find and remove the abnormally luminous light-emitting diodes before the bonding process, avoiding the problems that the abnormally luminous light-emitting diodes are difficult to remove and the laser cutting process damages the array substrate. The transshipment process is simplified, and the yield and efficiency of transshipment are improved. In addition, there is no need to add an additional non-visible light source, the structure is simple, and the detection cost is low.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method and equipment for transferring substrates and light-emitting diodes. Background technique [0002] With the development of light emitting diode (Light Emitting Diode, LED), micro light emitting diode (Micro-LED) display technology has become one of the hotspots of future display technology. control, high luminance, low power consumption, ultra-high resolution and high chromaticity, etc., but there are many technical difficulties in Micro-LED display technology, especially the mass transfer technology. [0003] The process of transferring Micro-LEDs is generally as follows: transfer Micro-LEDs to the array substrate, bind the electrodes of Micro-LEDs to the array substrate, control the light emission of Micro-LEDs for lighting detection, and use The laser cuts off the electrical connection between the electrode of the Micro-LED and the array substrate, thereby removing ...

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a transfer substrate, a transfer method for light-emitting diodes, and transfer equipment to solve the problem in the prior art that during the transfer process of Micro-LEDs, it is difficult to remove the abnormally luminous Micro-LEDs, and the use of laser The problem that cutting is easy to damage the array substrate

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