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A stacked thermopile with a hybrid structure

A hybrid structure and stacked technology, applied in the field of semiconductors, can solve the problem of small contact area of ​​thermocouple materials, achieve the effects of improving temperature sensitivity and resolution, increasing output voltage, and increasing contact area

Active Publication Date: 2022-05-24
NANJING UNIV OF POSTS & TELECOMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide a stacked thermopile with a hybrid structure to solve the problem of the relatively small contact area of ​​thermocouple materials existing in the prior art

Method used

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  • A stacked thermopile with a hybrid structure
  • A stacked thermopile with a hybrid structure
  • A stacked thermopile with a hybrid structure

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Embodiment Construction

[0025] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below with reference to the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention. The present invention is described in detail by using schematic diagrams. When describing the examples of the present invention in detail, for the convenience of description, the schematic diagrams are not partially enlarged according to the general scale, and should not be taken as a limitation of the present invention.

[0026] like figure 1 , Figure 4 As shown in the figure, a stacked thermopile with a hybrid structure, the thermopile is based on high-resistance silicon, and the stacked thermopile is formed by connecting thermocouples in series. The material used...

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Abstract

The invention discloses a stacked thermopile with a parallel structure, which belongs to the technical field of semiconductors. It includes a substrate; thermocouples connected in series and in parallel are arranged on the substrate. The invention has simple structure and is easy to realize. The contact area is increased, and the output voltage is increased, thereby improving the sensitivity and temperature resolution of the thermopile detector.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a stacked thermopile structure. Background technique [0002] Thermocouples are widely used in temperature measurement because of their simple structure, convenient use, high accuracy and wide temperature measurement range. Thermocouples are used to convert thermal potential differences into electrical potential differences. The basic working principle of the thermocouple is based on the thermoelectric effect of the object, also known as the Seebeck effect: one end of the conductors of two different materials, A and B, are closely connected together. An electric potential is created at the point, resulting in an electric current. The voltage generated by the Seebeck effect can be expressed as: [0003] [0004] S A with S B are the Seebeck coefficients of the two conductors, respectively. A thermopile is made up of multiple thermocouples connected in series, if S ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/02B81C1/00G01J5/12
CPCB81B7/02B81C1/00015G01J5/12B81B2201/0207B81B2201/0278
Inventor 王德波谷新丰魏良栋
Owner NANJING UNIV OF POSTS & TELECOMM