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Method for preparing micro flow channel heat radiator liquid inlet and outlet solder resist structure

A heat sink and micro-channel technology, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems that affect the yield of micro-channel cooling chips, micro-channel blockage failure, etc., to avoid Hole plugging and spin coating process, the effect of reducing process risk

Inactive Publication Date: 2019-10-01
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
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  • Application Information

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Problems solved by technology

With the continuous shrinking of the size of the microchannel, this process method is easy to introduce particulate matter during the process of blocking the inlet and outlet, and at the same time, a small amount of leakage of photoresist or organic matter may also enter the microchannel, making the microchannel inside the chip blocked. Failure, affecting the yield of micro-channel cooling chips

Method used

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  • Method for preparing micro flow channel heat radiator liquid inlet and outlet solder resist structure
  • Method for preparing micro flow channel heat radiator liquid inlet and outlet solder resist structure
  • Method for preparing micro flow channel heat radiator liquid inlet and outlet solder resist structure

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preparation example Construction

[0034] Thus, the present invention provides a method for preparing a microchannel heat sink 101 inlet and outlet 102 solder resist structure 103, such as figure 2 shown, including the following steps:

[0035] Step 1, using a positive template to imprint solder-resisting polymeric organic matter on the liquid inlet and outlet 102 of the micro-channel radiator 101;

[0036] In step 2, the solder resist structure 103 is obtained by curing the embossed solder resist polymer organic matter at high temperature.

[0037] The present invention prepares the solder resist structure 103 by adopting the micro-printing process of the positive template, avoids the process of hole plugging and spin coating, and reduces the process risk of micro-channel blockage.

[0038] Specifically, the positive template includes a ring-shaped stamp 302 . The cross-section of the annular stamp 302 is a ring, and its size is the same as that of the required solder resist structure 103. Thus, in step 1, ...

Embodiment

[0047] (1) Design the layout of the solder resist structure 103 according to the layout of the micro-channel radiator wafer 401, and set the positioning holes 402 at the corresponding positions of the micro-channel radiator wafer 401 and the layout of the solder resist structure 103;

[0048] (2) if image 3 As shown, take a silicon wafer 201 and apply a photoresist 202 on the silicon wafer 201, and obtain a negative template with an annular channel 203 on the silicon wafer 201 by photolithography according to the layout of the solder resist structure 103, and the annular channel The size and position of the channel 203 correspond to the solder resist structure 103 of the liquid inlet and outlet 102 of the microchannel radiator 101;

[0049] (3) if Figure 4As shown, the organic polymer material is injection-molded on the negative template. The organic polymer material in this embodiment is polydimethylsiloxane (PDMS), and then cured at 120° C. for 1 hour to obtain a ring-sha...

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Abstract

The invention discloses a method for preparing a micro flow channel heat radiator liquid inlet and outlet solder resist structure. The method comprises the steps of (1) performing imprinting on microflow channel heat radiator liquid inlet and outlet with a polymer organic substance by using a positive template, and (2) curing the imprinted polymer organic substance with high temperature to obtainthe solder resist structure. The solder resist structure is prepared by using the micro-printing process of the positive template, the process of plugging and spin coating process is avoided, and theprocess risk of blocking a micro flow channel is reduced.

Description

technical field [0001] The invention relates to the technical field of micro-nano processing of microelectronics, in particular to a method for preparing a solder resist structure of a liquid inlet and outlet of a micro-channel radiator. Background technique [0002] Power chips are the core components of radio frequency microsystems. The development of advanced semiconductor materials has continuously improved the performance of power chips. At present, the third-generation semiconductor technology represented by gallium nitride (GaN) has the characteristics of wide bandgap and can withstand higher The working junction temperature can reach 30W / mm (much higher than 0.5W / mm of GaAs), which can increase the output power of the electronic system by 5 times, while reducing the volume by half. However, in the microwave frequency range, the self-heating effect of GaN devices is quite serious, and the output heat flux density of some multi-gate GaN-based devices in the microwave f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473
CPCH01L23/473
Inventor 王文博卢茜张剑向伟玮蒋苗苗秦跃利王春富李彦睿张健李士群
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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