Sealing glass material, preparation method thereof and connecting component
A technology for sealing glass and glass, applied in the field of sealing materials, can solve problems such as difficulty in finding sealing materials, difficulty in sealing copper and copper alloy parts, etc.
Inactive Publication Date: 2019-10-08
BEIJNG ASAHI ELECTRONICS MATERIAL CO LTD
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Problems solved by technology
[0003] However, when sealing copper and copper alloy parts, the linear thermal expansion coefficient of copper is as high as 170×10 in the range of 25°C to 300°C. -7 / ℃~185×10 -7 / °C, so it is difficult to find a sealing material that matches the thermal expansion coefficient of copper or copper alloy, which makes it difficult to seal copper and copper alloy parts
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[0053] Embodiments of the present invention also provide a method for preparing a sealing glass material, such as figure 1 shown, including:
[0054] S100. Mix the first glass network former, the second glass network former, bismuth oxide, tellurium oxide, aluminum oxide, zinc oxide, calcium fluoride and the first additive to obtain a mixture. Wherein, the material of the first glass network former includes phosphorus pentoxide and / or phosphorus-containing compounds; the decomposition products of phosphorus-containing compounds include phosphorus pentoxide; the weight of the first glass network former accounts for the total weight of the sealing glass material The percentage is 30% to 60%; the material of the second glass network former is vanadium oxide, and the weight of vanadium oxide is 10% to 25% of the total weight of the sealing glass material; the weight of bismuth oxide is 10% to 25% of the sealing glass The percentage of the total weight of the material is 3% to 15%...
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The invention provides a sealing glass material, a preparation method thereof and a connecting component, and relates to the technical field of sealing materials. The sealing glass material can be used for sealing copper and copper alloy parts. Raw materials for preparing the sealing glass material comprise a first glass network former, a second glass network former, bismuth oxide, tellurium oxide, aluminum oxide, zinc oxide, calcium fluoride and a first additive, wherein the weight of the first glass network former accounts for 30-60% of the total weight of the sealing glass material, and thematerial of the second glass network former is vanadium oxide; the weight of vanadium oxide, bismuth oxide, tellurium oxide and alumina oxide accounts for 10-25%, 3-15%, 1-10% and 1-15% of the weightof the sealing glass material, the weight of zinc oxide accounts for 5-10% of the weight of the sealing glass material, and the weight of calcium fluoride accounts for 1-5% of the weight of the sealing glass material; and the first additive comprises boron oxide and / or a boron-containing compound, and the weight of the first additive accounts for 1-8% of the weight of the sealing glass material.
Description
technical field [0001] The invention relates to the technical field of sealing materials, in particular to a sealing glass material, a preparation method thereof, and a connecting component. Background technique [0002] With the continuous development of electronic technology in the fields of automotive electronics, household appliances, information and communication equipment, military and aerospace, the performance of electrical connectors made of Kovar alloy and stainless steel has been difficult to meet the needs of today's electronics industry. The light weight of electronic equipment Quantification, precision and functionalization have put forward an urgent demand for electronic materials. Because copper and copper alloys have the advantages of high strength, high electrical conductivity, high toughness, thermal shock resistance, no sparks generated by impact, and non-magnetic properties, electrical connecting devices made of copper and copper alloys have developed ra...
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Login to View More IPC IPC(8): C03C3/21
CPCC03C3/21
Inventor 卢克军秦国斌于洪林
Owner BEIJNG ASAHI ELECTRONICS MATERIAL CO LTD