Circuit board laminating and pressing method

Abstract

The invention relates to the technical field of circuit board processing, and discloses a circuit board laminating and pressing method; the circuit board laminating and pressing method comprises the following steps that a plurality of single-layer core boards which are stacked into a multi-layer board are prepared, wherein each core board comprises at least one layer of conductor layer; by takingthe center point of the single-layer core board as a base point, a plurality of sets of circuit arrangement are symmetrically designed on the single-layer core board, wherein at least four sets of circuit arrangement are arranged; punching is carried out on the single-layer core boards; tool holes are manufactured in a mode that a drilling mode is replaced by a process method of punching multipleholes in one time; and circuit processing is carried out on the single-layer core boards. According to the circuit board laminating and pressing method, by taking the center point of the single-layercore board as a base point, a plurality of sets of circuit arrangement are symmetrically designed on the single-layer core board, so that the resultant force on the multiple sets of circuits on the single-layer core boards in the subsequent pressing process is the same, the phenomenon that the circuit board is pressed in an offset mode due to non-uniform pressing stress of the circuit board is further avoided, and the effect of efficient pressing and offset prevention is achieved.

Description

technical field

[0001] The invention relates to the technical field of circuit board processing, in particular to circuit board pressing and pressing. Background technique

[0002] At present, in the PCB product design process, in order to meet the needs of terminal electronic products to the greatest extent, more complex electrical connection designs are usually used. The most prominent feature is the interconnection of any layer, specifically two or more adjacent layers. The electrical interconnection between the lines is carried out through blind holes. With the rapid development of electronic technology, electronic products are constantly developing towards miniaturization, light weight and high density. It is strongly required that the corresponding circuit boards equipped with semiconductor components are also small and lightweight With the development, in order to meet this demand, the thickness of any layer interconnect circuit board is correspondingly thinned, and t...