Circuit board laminating and pressing method
A technology for circuit boards and core boards, applied in printed circuit, multi-layer circuit manufacturing, printed circuit manufacturing, etc., can solve problems such as difficult to control drilling depth, waste of raw materials, production cost, unqualified circuit board quality, etc., to achieve processing depth Ease of control, reduction of waste, and the effect of saving raw materials
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Embodiment 1
[0026] Embodiment 1: circuit board pressing and pressing, it is characterized in that it includes the following steps:
[0027] 1) Prepare multiple single-layer core boards for stacking into multi-layer boards, each of which includes at least one conductor layer;
[0028] 2) Taking the center point of the single-layer core board as the base point, the single-layer core board is symmetrically designed to arrange multiple groups of circuits, and the multiple groups of circuits are arranged into four groups;
[0029] 3) Punch the single-layer core board, and use the process of punching out holes at one time instead of drilling to make tool holes;
[0030] 4) Carry out circuit processing on the single-layer core board, that is, substrate surface treatment process, photosensitive resist coating, exposure, etching and seed layer etching;
[0031] 5) Two-by-two lamination of multiple single-layer core boards, so that the multiple single-layer core boards maintain a high degree of sy...
Embodiment 2
[0039] Embodiment 2: circuit board pressing and pressing, it is characterized in that it includes the following steps:
[0040] 1) Prepare multiple single-layer core boards for stacking into multi-layer boards, each of which includes at least one conductor layer;
[0041] 2) Taking the center point of the single-layer core board as the base point, the single-layer core board is symmetrically designed to arrange multiple groups of circuits, and the multiple groups of circuits are arranged into eight groups;
[0042] 3) Punch the single-layer core board, and use the process of punching out holes at one time instead of drilling to make tool holes;
[0043] 4) Carry out circuit processing on the single-layer core board, that is, substrate surface treatment process, photosensitive resist coating, exposure, etching and seed layer etching;
[0044] 5) Two-by-two lamination of multiple single-layer core boards, so that the multiple single-layer core boards maintain a high degree of s...
Embodiment 3
[0052] Embodiment 3: circuit board pressing and pressing, it is characterized in that it includes the following steps:
[0053] 1) Prepare multiple single-layer core boards for stacking into multi-layer boards, each of which includes at least one conductor layer;
[0054] 2) Taking the center point of the single-layer core board as the base point, the single-layer core board is symmetrically designed to arrange multiple groups of circuits, and the multi-group circuit layout is at least four groups;
[0055] 3) Punch the single-layer core board, and use the process of punching out holes at one time instead of drilling to make tool holes;
[0056] 4) Carry out circuit processing on the single-layer core board, that is, substrate surface treatment process, photosensitive resist coating, exposure, etching and seed layer etching;
[0057] 5) Two-by-two lamination of multiple single-layer core boards, so that the multiple single-layer core boards maintain a high degree of symmetry du...
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