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A kind of porous silicon-silver nano dendrite structure and preparation method thereof

A technology of silver nanometer and crystal structure, which is applied in metal processing equipment, instruments, transportation and packaging, etc., can solve the problems of many steps and troublesome operation, and achieve the effect of simple steps, convenient operation and high surface-enhanced Raman scattering performance.

Active Publication Date: 2021-04-20
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has high requirements on the environment, and there are many steps, and the operation is troublesome.

Method used

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  • A kind of porous silicon-silver nano dendrite structure and preparation method thereof
  • A kind of porous silicon-silver nano dendrite structure and preparation method thereof
  • A kind of porous silicon-silver nano dendrite structure and preparation method thereof

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Embodiment 1

[0031] A kind of preparation method of porous silicon-silver nano dendrite structure, comprises the following steps:

[0032] Select material: select P-type silicon wafer, the silicon wafer is [100] oriented P-type single crystal silicon, the resistivity is 10-20Ω·cm, the thickness is 525μm, and the silicon wafer is divided into 1.5cm×1.5 cm square silicon wafer.

[0033] Cleaning the sample: Put the cut square silicon wafer into a beaker filled with deionized water, alcohol, and acetone in sequence for 10 minutes of ultrasonic cleaning, so as to remove the oil and impurities on the square silicon wafer.

[0034] Solution preparation: Use straws to take out 16mL of HF, 9mL of DMF and 8mL of silver nitrate solution on the operating table with a fume hood and put them into a plastic measuring cylinder to prepare an electrochemical corrosion solution, wherein the concentration of the silver nitrate solution is 1×10 -2 M.

[0035] Electrochemical corrosion: set the corrosion par...

Embodiment 2

[0040] A kind of preparation method of porous silicon-silver nano dendrite structure, comprises the following steps:

[0041] Select material: select P-type silicon wafer, the silicon wafer is [100] oriented P-type single crystal silicon, the resistivity is 10-20Ω·cm, the thickness is 525μm, and the silicon wafer is divided into 1.5cm×1.5 cm square silicon wafer.

[0042] Clean the sample: Put the cut square silicon wafer into a beaker filled with deionized water, alcohol, and acetone in turn for 10 minutes of ultrasonic cleaning.

[0043]Solution preparation: use straws to take out 16mL of HF, 9mL of DMF and 8mL of silver nitrate solution on the operating table with a fume hood and put them into a plastic measuring cylinder to prepare an electrochemical corrosion solution, wherein the concentration of the silver nitrate solution is 3×10 -2 M.

[0044] Electrochemical corrosion: set the corrosion parameters, put the cleaned square silicon wafer into an anodizing device fille...

Embodiment 3

[0049] A kind of preparation method of porous silicon-silver nano dendrite structure, comprises the following steps:

[0050] Select material: select P-type silicon wafer, the silicon wafer is [100] oriented P-type single crystal silicon, the resistivity is 10-20Ω·cm, the thickness is 525μm, and the silicon wafer is divided into 1.5cm×1.5 cm square silicon wafer.

[0051] Clean the sample: Put the cut square silicon wafer into a beaker filled with deionized water, alcohol, and acetone in turn for 10 minutes of ultrasonic cleaning.

[0052] Solution preparation: use straws to take out 16mL of HF, 9mL of DMF and 8mL of silver nitrate solution on the operating table with a fume hood and put them into a plastic measuring cylinder to prepare an electrochemical corrosion solution, wherein the concentration of the silver nitrate solution is 4×10 -2 M.

[0053] Electrochemical corrosion: set the corrosion parameters, put the cleaned square silicon wafer into an anodizing device fill...

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Abstract

The invention provides a porous silicon-silver nano-dendrite structure and a preparation method thereof, comprising the following steps: selecting material: selecting a P-type silicon chip, cutting the P-type silicon chip into a square silicon chip; cleaning the sample: cutting the square silicon chip Silicon wafers are cleaned; solution preparation: prepare an electrochemical etching solution, the electrochemical etching solution is composed of hydrofluoric acid HF, dimethylformamide DMF and silver nitrate solution, the hydrofluoric acid HF, dimethylformamide DMF and silver nitrate solution are mixed by the volume ratio of 16:9:8; Electrochemical corrosion: described square silicon chip is put into the container that fills described electrochemical corrosion solution, apply constant electric current and carry out electrochemical corrosion, obtain Porous silicon-silver nanodendritic structure. The present invention directly adds the silver nitrate solution into the electrochemical etching solution for corroding porous silicon, and can synthesize porous silicon-silver nano-dendrite structure in one step, with simple steps, convenient operation, short time consumption, fast and efficient preparation with good SERS performance base.

Description

technical field [0001] The invention belongs to the field of electrochemical corrosion and silicon microstructure preparation, and in particular relates to a porous silicon-silver nano-dendritic structure and a preparation method thereof. Background technique [0002] Since Fleischmann realized the detection of Vizha molecules adsorbed on the electrode through the silver electrode in the experiment in 1974, surface-enhanced Raman has become a research hotspot. Metal nanoparticles, and proved the possibility of porous silicon-metal as a surface-enhanced Raman scattering (SERS) substrate. In 2004, Haohao Lin synthesized silver nanodendrites on the surface of porous silicon by soaking method, and used rhodamine R6G as a probe Molecules were used to detect the SERS performance of the substrate, but it did not arouse people's interest at that time. It was not until 2014 that the research on the porous silicon composite metal nanomorphological structure caused a research boom. ...

Claims

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Application Information

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IPC IPC(8): C25D11/32C25F3/12B22F9/24B22F1/00G01N21/65
CPCC25D11/32C25F3/12B22F9/24G01N21/658B22F1/0553B22F1/07B22F1/054
Inventor 葛道晗魏金秀李文兵张立强杨平杨宁张桢苏兆亮
Owner JIANGSU UNIV