A kind of porous silicon-silver nano dendrite structure and preparation method thereof
A technology of silver nanometer and crystal structure, which is applied in metal processing equipment, instruments, transportation and packaging, etc., can solve the problems of many steps and troublesome operation, and achieve the effect of simple steps, convenient operation and high surface-enhanced Raman scattering performance.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0031] A kind of preparation method of porous silicon-silver nano dendrite structure, comprises the following steps:
[0032] Select material: select P-type silicon wafer, the silicon wafer is [100] oriented P-type single crystal silicon, the resistivity is 10-20Ω·cm, the thickness is 525μm, and the silicon wafer is divided into 1.5cm×1.5 cm square silicon wafer.
[0033] Cleaning the sample: Put the cut square silicon wafer into a beaker filled with deionized water, alcohol, and acetone in sequence for 10 minutes of ultrasonic cleaning, so as to remove the oil and impurities on the square silicon wafer.
[0034] Solution preparation: Use straws to take out 16mL of HF, 9mL of DMF and 8mL of silver nitrate solution on the operating table with a fume hood and put them into a plastic measuring cylinder to prepare an electrochemical corrosion solution, wherein the concentration of the silver nitrate solution is 1×10 -2 M.
[0035] Electrochemical corrosion: set the corrosion par...
Embodiment 2
[0040] A kind of preparation method of porous silicon-silver nano dendrite structure, comprises the following steps:
[0041] Select material: select P-type silicon wafer, the silicon wafer is [100] oriented P-type single crystal silicon, the resistivity is 10-20Ω·cm, the thickness is 525μm, and the silicon wafer is divided into 1.5cm×1.5 cm square silicon wafer.
[0042] Clean the sample: Put the cut square silicon wafer into a beaker filled with deionized water, alcohol, and acetone in turn for 10 minutes of ultrasonic cleaning.
[0043]Solution preparation: use straws to take out 16mL of HF, 9mL of DMF and 8mL of silver nitrate solution on the operating table with a fume hood and put them into a plastic measuring cylinder to prepare an electrochemical corrosion solution, wherein the concentration of the silver nitrate solution is 3×10 -2 M.
[0044] Electrochemical corrosion: set the corrosion parameters, put the cleaned square silicon wafer into an anodizing device fille...
Embodiment 3
[0049] A kind of preparation method of porous silicon-silver nano dendrite structure, comprises the following steps:
[0050] Select material: select P-type silicon wafer, the silicon wafer is [100] oriented P-type single crystal silicon, the resistivity is 10-20Ω·cm, the thickness is 525μm, and the silicon wafer is divided into 1.5cm×1.5 cm square silicon wafer.
[0051] Clean the sample: Put the cut square silicon wafer into a beaker filled with deionized water, alcohol, and acetone in turn for 10 minutes of ultrasonic cleaning.
[0052] Solution preparation: use straws to take out 16mL of HF, 9mL of DMF and 8mL of silver nitrate solution on the operating table with a fume hood and put them into a plastic measuring cylinder to prepare an electrochemical corrosion solution, wherein the concentration of the silver nitrate solution is 4×10 -2 M.
[0053] Electrochemical corrosion: set the corrosion parameters, put the cleaned square silicon wafer into an anodizing device fill...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Resistivity | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


