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A kind of preparation method of layered composite plate of 6061 aluminum alloy and t2 copper

An aluminum alloy plate and aluminum alloy technology, applied in metal rolling and other directions, can solve the problems of high production cost, high energy consumption, long production cycle, etc., and achieve good interfacial shear bonding strength, high thermal conductivity, and low price Effect

Active Publication Date: 2021-03-23
NORTHEAST LIGHT ALLOY CO LTD
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of high energy consumption, long production cycle, high production cost and poor overall mechanical properties of the prepared aluminum-copper layered composite plate in the existing rolling composite method, and provide a 6061 aluminum alloy Preparation method of layered composite board with T2 copper

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  • A kind of preparation method of layered composite plate of 6061 aluminum alloy and t2 copper

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specific Embodiment approach 1

[0014] Specific Embodiment 1: In this embodiment, a method for preparing a layered composite board of 6061 aluminum alloy and T2 copper is completed according to the following steps:

[0015] 1. Saw the 6061 aluminum alloy ingot to obtain a 6061 aluminum alloy plate with a length of 4000mm-5000mm, a width of 1200mm-1400mm, and a thickness of 400mm-450mm, and then mill the 6061 aluminum alloy plate to a thickness of 385mm-395mm. Keep the milled 6061 aluminum alloy plate at a temperature of 440°C-460°C for 20min-40min, and hot-roll the thickness of the 6061 aluminum alloy plate to 2mm-10mm under the same temperature condition; saw the T2 copper ingot Cut into a length of 4000mm-5000mm, a width of 1200mm-1400mm, and a thickness of 400mm-450mm to obtain a T2 copper plate, keep the T2 copper plate at a temperature of 480°C-500°C for 20min-40min, and heat the T2 copper plate under the same temperature condition. The thickness of the copper plate is hot-rolled to 2mm-10mm, and finall...

specific Embodiment approach 2

[0021] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is: the main elements and mass fractions contained in the 6061 aluminum alloy ingot described in step 1: Si is 0.2% to 1.0%, and Fe is 0.5% to 1.0% %, Cu is 0.15%~0.50%, Mn is 0.10%~0.50%, Mg is 0.04%~0.50%, Cr<0.40%, Zn is 0.10%~0.15%, Ti is 0.02%~0.04%, and total impurities< 0.15%, the balance is Al.

[0022] Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0023] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the 6061 aluminum alloy ingot described in step 1 is prepared according to the following steps:

[0024] (1) Weigh pure aluminum ingots, pure magnesium ingots, pure zinc ingots, aluminum-silicon master alloys, aluminum-manganese master alloys, aluminum-copper master alloys and aluminum-titanium master alloys according to the main elements and mass fractions contained in 6061 aluminum alloy ingots;

[0025] (2) After melting part of the pure aluminum ingots weighed in step (1), pour them into the base in the crystallizer, and then pour the pure zinc ingots, aluminum-silicon intermediate alloys, and aluminum-manganese intermediates weighed in step (1) Alloy, aluminum-copper master alloy, aluminum-titanium master alloy and the remaining pure aluminum ingots are added to the melting furnace, the temperature is raised to 740 ° C ~ 760 ° C, after melting, stirring is carried out and the slag is ...

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Abstract

The invention discloses a preparation method of a 6061 aluminum alloy and T2 copper laminated composite board, and relates to the technical field of preparation of metal laminated composite boards. The preparation method of the invention aims to solve the problems of high energy consumption, long production period, high production cost and poor overall mechanical property of the prepared aluminum-copper laminated composite board in the conventional rolling compounding method. The method comprises the following steps of firstly, performing cold rolling on a 6061 aluminum alloy plate and a T2 copper plate, performing hot rolling on the cold-rolled 6061 aluminum alloy plate and the T2 copper plate at a certain temperature, performing cold finish rolling on the hot-rolled 6061 aluminum alloy plate and the T2 copper plate after air cooling to room temperature, and finally sawing the length and the width of the cold finish-rolled 6061 aluminum alloy plate and the T2 copper plate into the same size to obtain the 6061 aluminum alloy and T2 copper laminated composite board. The invention is suitable for providing the preparation method of the 6061 aluminum alloy and T2 copper laminated composite board.

Description

technical field [0001] The invention relates to the technical field of metal layered composite plate preparation. Background technique [0002] Both aluminum and copper have good electrical and thermal conductivity, and are the basic materials in power transmission and heat transfer engineering. With the increasing shortage of copper resources, it has become an inevitable trend to replace copper with aluminum. Compared with copper, the surface contact resistance of aluminum is large, and it is still difficult to directly replace copper with aluminum for many parts. A layer of copper is directly compounded on the aluminum surface, and the prepared aluminum-copper layered composite board can improve the contact resistance of the aluminum surface, improve the welding performance, and has the advantages of low price and light weight. It is widely used in electric conduction industry, heat conduction industry and decoration industry. For example, many important components in h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21C37/02B21B1/38C22C21/02C22C21/00C22C1/03C22C9/00C22F1/043C22F1/08
CPCB21B1/38B21B2001/386B21C37/02C22C1/026C22C1/03C22C9/00C22C21/00C22C21/02C22F1/043C22F1/08
Inventor 韩明明王英君张宏亮雷金琴张旭阳张磊鲁月吴沂哲张云龙李彬张立君
Owner NORTHEAST LIGHT ALLOY CO LTD
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