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Adhesive tape, article, motor and manufacturing method of article

An adhesive tape and bonding technology, which is applied in the direction of bonding method, adhesive, and adhesive type using foam adhesives, which can solve the problem of adhesive tape bonding position offset, no initial adhesion, Problems such as low initial adhesion on the surface of the adhesive tape to achieve the effect of excellent adhesive strength

Inactive Publication Date: 2019-10-22
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this adhesive tape needs to be inserted into the gap between the parts before the parts are fixed by thermal expansion, so the initial adhesiveness of the surface of the adhesive tape at normal temperature is low or no initial adhesiveness.
Therefore, even if it is inserted into the gap between the components, it cannot be adhered to the components immediately thereafter. Therefore, before the adhesive tape is swollen and bonded / fixed in the early stage, there is a possibility that the above-mentioned adhesive tape may deviate from the predetermined position. The risk of shifting the bonding position of the above-mentioned adhesive tape and the above-mentioned components

Method used

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  • Adhesive tape, article, motor and manufacturing method of article
  • Adhesive tape, article, motor and manufacturing method of article
  • Adhesive tape, article, motor and manufacturing method of article

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0085]

[0086] By adding 7.0 parts by mass of epoxy resin 1 (epoxy equivalent of 403g / eq., liquid (25°C), viscosity of 1.4 million mPa·s (25°C)), epoxy resin 2 (epoxy equivalent of 162g / eq ., solid state (25°C), melt viscosity at 150°C is 0.2dPa·s, softening point is 25°C) 28 parts by mass, epoxy resin 3 (epoxy equivalent is 8000g / eq., solid state (25°C), 216.7 parts by mass of a methyl ethyl ketone solution (30% by mass of solid content) with a softening point of 200°C or higher, a curing agent (2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl base-secondary triazine isocyanuric acid adduct) 2.0 parts by mass were mixed to prepare a thermosetting adhesive composition (a-1).

preparation example 2

[0088] Change epoxy resin 1 from 7 parts by mass to 2 parts by mass, and use 5 parts by mass of epoxy resin 4 (epoxy equivalent: 130g / eq., liquid (25°C), viscosity: 300mPa·s (25°C)), Other than that, the thermosetting adhesive composition (a-2) was obtained by the method similar to preparation example 1.

preparation example 3

[0090]

[0091] In a reaction vessel equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel, and a nitrogen inlet, 80 parts by mass of butyl acrylate, 15 parts by mass of acrylic acid, 5 parts by mass of hydroxyethyl acrylate, and 2 as a polymerization initiator, An acrylic copolymer (S-1) solution having a weight average molecular weight of 1 million was obtained by dissolving 0.1 parts by mass of 2'-azobisisobutyronitrile in 100 parts by mass of ethyl acetate and polymerizing at 70° C. for 10 hours.

[0092]Next, to the above-mentioned acrylic copolymer (S-1) solution, 10 parts by mass of an epoxy-based crosslinking agent ("E-05X" manufactured by Soken Chemical Co., Ltd., Solid content: 0.5 mass %), ethyl acetate was added, and it stirred for 20 minutes, and the pressure-sensitive-adhesive composition (b-1) whose nonvolatile matter was 30 mass % was obtained.

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Abstract

The invention relates to an adhesive tape, an article, a motor and a manufacturing method of the article. It is an object of the present invention to provide an adhesive tape which can be expanded bya stimulus such as heating, has an excellent initial adhesive property even at room temperature (23 DEG C), and can maintain an excellent adhesive strength even after expansion. The present inventionrelates to an adhesive tape having a pressure-sensitive adhesive layer (B) having a thickness of 1 micron or more and 100 microns or less and a 180-degree peel bond strength at room temperature (23 DEG C) of 1N / 20 mm or more, directly or via another layer, on one side of an expandable adhesive layer (A) containing a thermosetting resin.

Description

technical field [0001] The present invention relates to an adhesive tape having a configuration in which the volume expands when a stimulus such as heating is applied. Background technique [0002] The above-mentioned adhesive tape can be suitably used when fixing two or more adherends, and therefore is widely used in manufacturing sites of various products such as automobiles and electric equipment. [0003] Adhesive tapes are generally suitably used for fixing one adherend to a planar portion, a curved portion, or the like of another adherend, and are widely used in manufacturing sites of various products including automotive parts and electric equipment. On the other hand, in the case where it is expected to gradually expand the application range of the adhesive tape, it is required that the above-mentioned adhesive tape can be used suitably in the case of, for example, fixing one adherend to the space that another adherend has. . Specifically, as a motor mounted on a h...

Claims

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Application Information

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IPC IPC(8): C09J5/08C09J7/10C09J7/25C09J7/30C09J7/38C09J163/00C09J133/08
CPCC09J5/08C09J7/10C09J7/255C09J7/30C09J7/385C09J163/00C09J133/14C08L2205/025C08L2205/03C08L2205/035C08L63/00C08L93/04
Inventor 唐泽久美子森野彰规
Owner DIC CORP