Processing technology for reducing distance between V-CUT wire and wire

A V-CUT, V-CUT1 technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of inability to reduce the spacing, low utilization rate of spacing, and inability to process, etc., to increase internal utilization, Effects of reduced conductor pitch and optimized wiring

Active Publication Date: 2019-10-22
深圳市星河电路股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When the PCB printed circuit board is in production, the existing process is V-CUT in front of the gong board or V-CUT behind the gong board, and the minimum distance between the V-CUT line and the wire (copper skin or wire) in the board is 0.4 mm, if the distance between them is reduced, it cannot be processed, and there is a risk of damaging the wire during V-CUT, and the normal process cannot reduce the distance between
With the rapid development of society, the volume of many electronic instruments is also shrinking, and the precision, size and volume of the corresponding PCB boards also change accordingly. The utilization rate of excessively large spacing is low, and it cannot adapt to faster and faster Social development

Method used

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  • Processing technology for reducing distance between V-CUT wire and wire
  • Processing technology for reducing distance between V-CUT wire and wire

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Embodiment 1

[0028] A kind of processing technology that reduces V-CUT wire to wire pitch, comprises the steps:

[0029] S1. Graphical electrical processing: Graphical electroplating processing of PCB printed circuit boards to achieve the purpose of thickening lines and copper thickness in holes, and ensuring its electrical conductivity and physical properties;

[0030] S2, V-CUT1 / 3 processing: set the V-CUT depth parameter on the automatic V-CUT machine to be 1 / 3 of the thickness of the PCB printed circuit board, and single Surface V-CUT processing;

[0031] S3. Alkaline etching: etching the PCB printed circuit board by alkaline etching;

[0032] S4. Solder resistance: apply a layer of solder resist on the surface of the PCB printed circuit board that does not need to be soldered and on the base material, and play the role of solder resistance insulation, prevent oxidation, and beautify the appearance, while protecting the unnecessary Solder the circuit to prevent tin from entering and ...

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Abstract

The invention discloses a processing technology for reducing distance between a V-CUT wire and a wire. The processing technology comprises following steps: electrical processing; V-CUT 1 / 3 processing;alkaline etching; resistance welding; characters; gold sedimentation; V-CUT 2 / 3 processing; and routing. According to the invention, the distance of between the V-CUT wire and an inner conductor of aboard can be reduced, and the purpose of reducing the distance between the V-CUT wire and the conductor can be achieved only by adding one flow. According to the invention, the conductor will not bedamaged after the V-CUT, and the finished product sub-board is not affected after the piece is loaded, the internal utilization ratio of the board is improved, wiring is better and the whole board design is optimized. According to the invention, the difficult V-CUT line is moved to the V-CUT before etching, the V-CUT mode is adjusted, the V-CUT depth of one face close to the conductor is adjustedto 1 / 3 of the V-CUT depth, and the depth of the V-CUT of the other face is adjuste to 2 / 3, so the finished sub-board and the burrs are not affected.

Description

technical field [0001] The invention belongs to the technical field of PCB board processing, and more specifically relates to a processing technology for reducing the distance between a V-CUT wire and a wire. Background technique [0002] PCB circuit board, also known as printed circuit board, is the provider of electrical connection for electronic components. The main advantage of using circuit boards is to greatly reduce the errors of wiring and assembly, and improve the level of automation and production labor rate. According to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. [0003] V CUT, as a tool in the electronics industry, is also known as PCB board V-CUT micro-cutting knife, VCUT knife, micro-cutting knife, and it is also called V-pit knife or V-groove knife. It is mainly used for PCB circuit board V-CUT Carbide cutting tools for VCU...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/0228
Inventor黄江波罗良禄
Owner深圳市星河电路股份有限公司