In situ modification method of electronic grade spherical packing

A spherical filler and in-situ modification technology, which is applied in the field of in-situ modification of electronic grade spherical fillers, can solve the problems of spherical fillers that cannot be mechanically ground, spherical particle defects, expensive materials, etc., and achieve compatibility and binding force Excellent, excellent hydrophobic performance, simple process effect

Active Publication Date: 2019-10-25
JIANGSU NOVORAY NEW MATERIAL CO LTD
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, in the process of use, there will be problems of compatibility and bonding between inorganic fillers and organic resins, especially when the filling amount of inorganic fillers reaches a certain level, the more obvious the defects will be.
[0003] The prior art discloses an invention patent whose application number is 200810024250.3 and which is called electronic-grade ultrafine silicon powder dry method surface modification method. The method uses ultrafine silicon powder as raw material and modified mixed solution as modifier to prepare Modified products, the disadvantage is intermittent, increased modification process and polluted products;
[0004] The prior art discloses another invention patent with the application number 201010595909.8 and the name of the method for synthesizing hydrophobic nano-silica particles by combustion method. This method uses organic precu

Method used

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  • In situ modification method of electronic grade spherical packing
  • In situ modification method of electronic grade spherical packing

Examples

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Embodiment 1

[0018] Example 1, an in-situ modification method of electronic grade spherical fillers, the method selects spherical fillers with an average particle diameter D50 between 0.01 μm and 60 μm, and introduces the spherical fillers into one or more of oxygen, air or nitrogen. Several kinds are used as the carrier gas, in a reaction vessel in which natural gas is the combustible gas and oxygen is the combustion aid, the spheroidization is ignited and cooled after the spheroidization is completed. When cooling to 80°C-150°C, add coupling The coupling agent is added in an amount of 0.1% of the total weight of the spherical filler, thereby preparing the in-situ modified spherical filler.

Embodiment 2

[0019] Example 2, an in-situ modification method of electronic-grade spherical fillers, the method selects spherical fillers with an average particle diameter D50 between 0.01 μm and 60 μm, and introduces the spherical fillers into one or more of oxygen, air or nitrogen. Several kinds are used as the carrier gas, in a reaction vessel in which natural gas is the combustible gas and oxygen is the combustion aid, the spheroidization is ignited and cooled after the spheroidization is completed. When cooling to 80°C-150°C, add coupling agent, and the addition of coupling agent accounts for 2% of the total weight of the spherical filler, thereby preparing the in-situ modified spherical filler.

Embodiment 3

[0020] Example 3, an in-situ modification method of electronic grade spherical fillers, the method selects spherical fillers with an average particle diameter D50 between 0.01 μm and 60 μm, and introduces the spherical fillers into one of oxygen, air or nitrogen or Several kinds are used as the carrier gas, in a reaction vessel in which natural gas is the combustible gas and oxygen is the combustion aid, the spheroidization is ignited and cooled after the spheroidization is completed. When cooling to 80°C-150°C, add coupling agent, and the addition amount of the coupling agent accounts for 1% of the total weight of the spherical filler, thereby preparing the in-situ modified spherical filler.

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Abstract

The invention discloses an in situ modification method of electronic grade spherical packing. The in situ modification method comprises the steps that spherical packing with the average particle sizeD50 between 0.01 [mu]m and 60 [mu]m is selected, the spherical packing is led into a reaction vessel, igniting and spheroidization are conducted, cooling is conducted after spheroidization, when the temperature is cooled to 80 DEG C to 150 DEG C, a coupling agent is added into the spherical packing after spheroidization, the additive amount of the coupling agent accounts for 0.1% to 2% of the total weight of the spherical packing, and thus the spherical packing after modified in situ is prepared; and the coupling agent is one or more of hexamethyldisiloxane, polysiloxane, dihydroxydimethylsilane and a silane coupling agent. According to the in situ modification method, in the spheroidization and cooling processes of the spherical packing, the coupling agent is adopted to modify the spherical packing in situ by using residual heat, and thus the spherical inorganic packing modified in situ has excellent hydrophobic performance, good particle dispersion and excellent compatibility and binding force with organic resin.

Description

technical field [0001] The invention belongs to the technical field of deep processing of inorganic non-metallic materials, and in particular relates to an in-situ modification method of electronic-grade spherical fillers. Background technique [0002] Inorganic fillers are used in resin systems and are widely used in industries such as epoxy molding compounds, coatings, adhesives and inks. However, in the process of use, there will be problems of compatibility and bonding between inorganic fillers and organic resins, especially when the filling amount of inorganic fillers reaches a certain level, the more obvious the defects will be. [0003] The prior art discloses an invention patent whose application number is 200810024250.3 and which is called electronic-grade ultrafine silicon powder dry method surface modification method. The method uses ultrafine silicon powder as raw material and modified mixed solution as modifier to prepare Modified products, the disadvantage is ...

Claims

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Application Information

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IPC IPC(8): C08K9/02C08K9/06C08K9/08C08K7/18
CPCC08K7/18C08K9/02C08K9/06C08K9/08C08K2201/005
Inventor 李晓冬张建平曹家凯姜兵
Owner JIANGSU NOVORAY NEW MATERIAL CO LTD
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