Chip atomic air chamber glue bonding system and glue bonding process preparation method
An atomic gas chamber and bonding technology, which is applied in metal processing equipment, metal material coating technology, and patterned surface photoplate making technology, can solve problems such as low work efficiency and complicated operation
Inactive Publication Date: 2019-11-05
NAT INST OF METROLOGY CHINA
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Problems solved by technology
[0004] Based on this, it is necessary to provide a chip atomic air chamber adhesive bonding system and adhesive bonding process with simple operation for the problems of complex operation and low work efficiency of the anaerobic anhydrous anodic bonding system processed by the traditional chip atomic air chamber Preparation
The gas storage device is used to store gas
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[0033] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail through the following embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.
[0034] The serial numbers assigned to components in this document, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "connection" mentioned in this application all include direct and indirect connection (connection) unless otherwise specified. In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom"...
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According to the chip atomic air chamber glue bonding system and the glue bonding process preparation method provided by the invention, air in the bonding chamber is replaced through the chip atomic air chamber glue bonding system, and an oxygen-free environment is realized. High-purity Ar gas or nitrogen gas is repeatedly introduced into the bonding chamber through the gas storage device, and vacuumizing is carried out for at least three times, so that the bonding chamber is kept in a vacuum state when the chip atomic gas chamber glue bonding system is in a non-working state. When the chip atomic air chamber glue bonding system works, required buffer gas is introduced. Meanwhile, an alkali metal source and a buffer gas are placed in the chip atom gas chamber. Buffer gas atmosphere is provided during working through the gas storage device, the pressure reduction control device and the gas flow control device. The device involved in the chip atomic air chamber glue bonding system is lowin cost. Through low-cost construction of the chip atomic air chamber glue bonding system, the preparation of the chip atomic air chamber can be realized more conveniently at low cost.
Description
technical field [0001] The present application relates to the field of atomic air chambers, in particular to a glue bonding system for chip atomic air chambers and a preparation method for glue bonding. Background technique [0002] Integrated circuit technology and the miniaturization and multifunctional integration of electronic devices have promoted the development of MEMS technology. MEMS uses advanced semiconductor technology and technology to integrate machinery, electronics and even systems into one chip, and has great application prospects in aerospace, information communication, biomedical and other fields. In recent years, with the development of atomic physics, semiconductor lasers and micro-nano manufacturing technology, the requirements for high-precision, micro-volume MEMS atomic devices are getting higher and higher. In application systems such as chip-level atomic clocks and chip-level magnetometers, and in chip-level metrology-based standard systems, chip a...
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IPC IPC(8): B81C1/00B81C3/00
CPCB81C1/00015B81C3/001B81C2203/032
Inventor 王雪深林平卫李劲劲蒋志远
Owner NAT INST OF METROLOGY CHINA